Knowledge Center

Introduction In Rigid-Flex PCB manufacturing, polyimide (PI) coverlay is critical for insulating and mechanically supporting flexible circuits. Lamination parameters directly affect adhesion strength, flex endurance, and high-frequency performance. 1. C...

Ceramic substrates (e.g., Al₂O₃, AlN, LTCC) are widely used in power modules and RF devices due to their high thermal conductivity and insulation. However, thermal cracks induced during laser drilling significantly degrade mechanical strength and electri...

Introduction The modified Semi-Additive Process (mSAP), critical for HDI PCB fabrication, achieves 5/5μm line/space through ultrathin seed layer plating and selective etching. Uniformity and selectivity in seed layer etching directly determine line wall ...

Introduction In SMT manufacturing, 0402 components (1.0mm×0.5mm) are prone to tombstoning defects—where one end lifts off the pad due to uneven solder paste or thermal stress—causing electrical opens. Traditional AOI systems relying on thr...

X - ray Image Acquisition 1. Film - based X - ray Inspection Film - based X - ray inspection systems utilize industrial X - ray cabinets and X - ray film cassettes to record X - ray images on film. Then, the images are viewed through a film video player for ...

The critical challenge in assembling high-speed optical modules (e.g., 400G/800G) lies in achieving sub-micron optical axis alignment between laser diodes (LDs) and PCB-embedded waveguides. Axial misalignment exceeding ±0.5μm causes significant cou...

Introduction Press-fit connectors, valued for solderless reliability, are widely used in automotive and industrial electronics. Their electrical connection relies on elastic deformation between metal pins and plated through holes (PTHs), where hole toleranc...

Introduction Rigid-flex PCBs, known for their 3D layout flexibility and reliability, are widely used in aerospace, wearables, and medical electronics. However, mechanical stress concentration in bend areas and structural failures in transition zones remain ...

Introduction As electronic devices evolve toward miniaturization, high-frequency operation, and increased integration, power integrity (PI) has emerged as a critical challenge in high-speed PCB design. Traditional decoupling capacitors mounted on the surfac...

1. Technical Challenges & Void Formation Mechanisms In HDI PCB and IC substrate manufacturing, void-free plating of micro-vias (e.g., 50μm diameter, 10:1 aspect ratio) faces critical challenges: Mass transfer limitation: Poor electrolyte flow in dee...