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Sintered silver paste, a key interconnect material for power modules, requires porosity control below 5% to ensure low thermal resistance (50MPa). Porosity >5% reduces thermal cycling lifetime by over 40%. 1. Material System Optimization 1.1 Silver Part...

As the core carrier of electronic devices, the design and manufacturing of custom PCBs (Printed Circuit Boards) directly determine product performance and reliability. With years of industry expertise and technological innovation, Minintel is committed to pr...

Aerospace electronics must operate reliably in extreme environments (vacuum, radiation, -180℃~+150℃). NASA standards like NASA-STD-8719.27 mandate stringent cleanliness: ≤100 particles/ft³ (≥0.5μm), non-volatile residue (NVR) ≤1μg/cm&...

Selective Electroless Nickel Immersion Gold (ENIG) in advanced IC substrates and HDI PCBs requires defect-free plating resist patterning within 50μm pitch. The micron-scale accuracy and chemical resistance of the resist layer determine pad-line insulation...

Metal-core substrates (e.g., aluminum/copper) are vital for high-power electronics (LEDs, automotive systems) due to their thermal management. The insulation layer must balance high thermal conductivity (>2W/mK) and dielectric strength (>5kV/mm), often confl...

Hyper Very Low Profile (HVLP) copper foil (Rz0.5μm)—causes additional 0.2dB/cm loss at mmWave frequencies. 1. Serration Formation Mechanisms 1.1 Micro-Etching Dynamics (Figure 1) Copper etching anisotropy: Cu+2FeCl3→CuCl2+2FeCl2Cu+2FeCl3...

Embedded passive components (EPCs, e.g., resistors/capacitors) enable high-density PCB integration but face post-lamination shifting (>50μm) due to thermal-mechanical stresses, causing impedance mismatch and signal loss. This guide details anti-shifting s...

Surface roughness of high-frequency circuits (e.g., 5G mmWave antennas, SerDes traces) directly impacts signal loss and impedance consistency. At Ra>0.5μm, skin effect-induced loss exceeds 15% at 28GHz. Electrochemical polishing (ECP) enables atomic-level...

Micro-shorts (20dB. 2. Key Procedures and Parameter Optimization 2.1 Workflow Prescan: Low resolution (640×480) to locate hotspots; Lock-in acquisition: High resolution (1024×768) over 100-200 cycles; Phase demodulation: FFT ex...

Ultra-thin flexible circuits (FPCs,