Company Profile

Minintel Technology Co., Limited

Minintel Technology Co., Limited was established in Zhongwu Industrial Park, Bao'an District, Shenzhen, China in 2007. After nearly two decades of development and accumulation, the company's PCB business has achieved the production capacity of "high multi-layer, high precision, high reliability, and various types", with the maximum number of layers reaching 42. It covers various board types such as FR-4 rigid boards, FPCs, rigid-flex boards, HDI PCBs, high-precision multilayer PCBs, high-frequency boards, thermoelectric separation copper substrates, aluminum substrates, and so on.

The company provides multi-dimensional production modes such as PCB, PCBA sampling, small-batch, and large-batch production, as well as technologies and services such as steel mesh/fixtures. It has established a complete PCB intelligent manufacturing system, creating solutions for the electronics and machinery industries with excellent technological capabilities, building an intelligent industrial ecosystem, and widely applying its products to computers, aerospace, automotive electronics, new energy (wind power, photovoltaic), big data centers, industrial interconnection, medical instruments, industrial control, and other fields, helping various industries achieve technological innovation.

2007

Year

Established in

Exporting countries and regions

10000

m²

Factory floor area

1000

Employees

Product line

Workshop

Solder paste printing

Solder paste inspection

Component placement

Plug-in welding

Image detection

Radiographic testing

three-proofing paint

Visual inspection

Workshop
The fully automated production line is the solid foundation for our efficient production and timely delivery.

Solder paste printing
Fully automatic solder paste printing machines are equipped with an optical alignment system, which automatically aligns the stencil apertures with the PCB pads by recognizing the Mark points on the PCB, thus enabling fully automated operation.

Solder paste inspection
80% of the defects in SMT production come from poor solder paste printing, and fully automatic three-dimensional solder paste inspection (SPI) equipment can control printing defects to the greatest extent.

Component placement
With a maximum mounting speed of 45,000 components per hour, it is still capable of efficiently and accurately placing high-precision components such as BGA.

Plug-in welding
Selective wave soldering can set the welding parameters for each solder joint, allowing for better process adjustments based on the points to be soldered, greatly improving the reliability of soldering.

Image detection
AOI (Automated Optical Inspection) is an automated optical inspection system that uses optical principles to detect defects encountered during welding production.

Radiographic testing
Automatic X-ray detection technology can detect invisible solder joints BGA, IC chips, CPUs, etc., and can also perform qualitative and quantitative analysis on the detection results to facilitate early detection of faults.

Three-proofing paint
The application of three-proofing paint can protect circuits/components from environmental factors such as moisture, contaminants, corrosion, and thermal cycling, while also improving the mechanical strength and insulation properties of the product.

Visual inspection
Using a high-magnification imaging system, we can observe the welding of components in all directions and strictly control product quality.

Company Profile

Product line

Workshop The fully automated production line is the solid foundation for our efficient production and timely delivery.

Solder paste printing Fully automatic solder paste printing machines are equipped with an optical alignment system, which automatically aligns the stencil apertures with the PCB pads by recognizing the Mark points on the PCB, thus enabling fully automated operation.

Solder paste inspection 80% of the defects in SMT production come from poor solder paste printing, and fully automatic three-dimensional solder paste inspection (SPI) equipment can control printing defects to the greatest extent.

Component placement With a maximum mounting speed of 45,000 components per hour, it is still capable of efficiently and accurately placing high-precision components such as BGA.

Plug-in welding Selective wave soldering can set the welding parameters for each solder joint, allowing for better process adjustments based on the points to be soldered, greatly improving the reliability of soldering.

Image detection AOI (Automated Optical Inspection) is an automated optical inspection system that uses optical principles to detect defects encountered during welding production.

Radiographic testing Automatic X-ray detection technology can detect invisible solder joints BGA, IC chips, CPUs, etc., and can also perform qualitative and quantitative analysis on the detection results to facilitate early detection of faults.

Three-proofing paint The application of three-proofing paint can protect circuits/components from environmental factors such as moisture, contaminants, corrosion, and thermal cycling, while also improving the mechanical strength and insulation properties of the product.

Visual inspection Using a high-magnification imaging system, we can observe the welding of components in all directions and strictly control product quality.