PCB
FPC
Rigid-Flex
FR-4
HDI PCB
Rogers High-Frequency Board
PTFE Teflon High-Frequency Board
Aluminum
Copper Core
PCB Assembly
LED light PCBA
Memory PCBA
Power Supply PCBA
New Energey PCBA
Communication PCBA
Industrial Control PCBA
Medical Equipment PCBA
Product Rebuild
PCB Copy
IC Cracking
Testing Service
PCBA Testing Service
Certification Application
RoHS Certification Application
REACH Certification Application
CE Certification Application
FCC Certification Application
CQC Certification Application
UL Certification Application
Transformers, Inductors
High Frequency Transformers
Low Frequency Transformers
High Power Transformers
Conversion Transformers
Sealed Transformers
Ring Transformers
Inductors
Wires,Cables Customized
Network Cables
Power Cords
Antenna Cables
Coaxial Cables
Capacitors
Connectors
Diodes
Embedded Processors & Controllers
Digital Signal Processors (DSP/DSC)
Microcontrollers (MCU/MPU/SOC)
Programmable Logic Device(CPLD/FPGA)
Communication Modules/IoT
Resistors
Through Hole Resistors
Resistor Networks, Arrays
Potentiometers,Variable Resistors
Aluminum Case,Porcelain Tube Resistance
Current Sense Resistors,Shunt Resistors
Switches
Transistors
Power Modules
Isolated Power Modules
AC-DC Power Modules
DC-AC Module(Inverter)
RF and Wireless
Advanced PCB
Advanced PCB refers to printed circuit boards with more intricate designs and higher technological sophistication. These are commonly found in high-end electronic devices, communication infrastructure, aerospace applications, medical equipment, high-performance computing, and other scenarios where a high degree of integration and reliability is required.
| No. | Item | Process capability parameter |
|---|---|---|
| 1 | PCB type | Rigid PCB |
| 2 | Base Material | See Below “Material” Chart |
| 3 | Layer Count | 1-40 layers |
| 4 | Finished Copper Thickness | 0.5-6 oz |
| 5 |
Min trace width/spacing |
Inner layer: 2 / 2mil Outer layer: 2.5 / 2.5mil |
| 6 | Min Spacing Between Hole to Inner Layer Conductor | 7mil |
| 7 | Min Spacing Between Hole to Outer Layer Conductor | 6mil |
| 8 | Min Annular Ring for Via | 3mil |
| 9 | Min Annular Ring for Component Hole | 6mil |
| 10 | Min BGA Diameter | 8mil |
| 11 | Min BGA Pitch | 0.1mm |
| 12 | Min Hole Size | 0.15mm(CNC)｜0.1mm(Laser) |
| 13 | Max Aspect Ratio | 12:1 |
| 14 | Min Soldermask Bridge Width | 3mil |
| 15 | Soldermask / Circuit Processing Method | Film | LDI |
| 16 | Min Thickness for Insulating Layer | 2mil |
| 17 | HDI & Special Type PCB | HDI(1-3 steps)｜High frequency mix-pressing (2-14 layers)｜Buried capacitance & resistance, etc. |
| 18 | Surface Finish | ENIG｜HASL｜HASL lead free｜OSP｜Immersion Tin｜Immersion Silver｜Plating Hard Gold｜Plating Silver |
| 19 | Max PCB size | 500*600mm |
| Item | Material for PCB Prototype | Material for Small and Medium Batch |
|---|---|---|
| General Tg FR4 | shengyi S1141, Kingboard KB6160A | shengyi S1141 |
| High-Tg Halogen-free | shengyi S1170G Halogen-free TG170, TU-862 HF TG170 | shengyi S1170G Halogen-free TG170 ,TU-862 HF TG170 |
| Medium Tg Halogen-free | shengyi S1150G Halogen-free TG150 | shengyi S1150G Halogen-free TG150 |
| High Halogen-free CTI | shengyi S1151G( CTI≥600V) | shengyi S1151G( CTI≥600V) |
| High CTI | shengyi S1600( CTI≥600V)Kingboard KB6160C | shengyi S1600( CTI≥600V)Kingboard KB6160C |
| Special Material (High low temperature) | shengyi SH260 | shengyi SH260 |
| High Tg FR4 | S1000-2, S1000-2M, IT180A | S1000-2, S1000-2M, IT180A |
| Ceramic Powder Filled High Frequency | Rogers4003, Rogers4350, Arlon25N, shengyi S7136 | Rogers4350, Rogers4003, shengyi S7136 |
| PTFE High Frequency Material | Rogers, Taconic, Arlon, Taizhou wangling | Rogers, Taconic, Arlon, Taizhou wangling |
| High Frequency PCB PP | RO4450 0.1mm, shengyi Synamic6 | RO4450 0.1mm, shengyi s6 |