
Flexible PCB
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible insulating substrates. Flexible circuits offer excellent electrical performance, meeting the design requirements for smaller size and higher density installation, while also contributing to reduced assembly processes and enhanced reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products.
They can be freely bent, rolled, and folded, capable of withstanding millions of dynamic bends without damaging the conductors. They can be arranged according to spatial layout requirements and move and stretch in three-dimensional space at will, achieving the integration of component assembly and wire connection. Flexible circuit boards can significantly reduce the volume and weight of electronic products, catering to the needs of electronics moving towards higher density, miniaturization, and higher reliability.
| No. | Item | Process Capability Patameter |
|---|---|---|
| 1 | PCB Type | Flexible PCB |
| 2 | Quality Grade | Standard IPC 2 |
| 3 | Material | PI, PET |
| 4 | Number of Layers | 1 Layer, 2 Layers, 4 Layers, 6 Layers, 8 Layers |
| 5 | Max PCB Size | 500mm*250mm |
| 6 | Board Size Tolerance (Outline)
|
±0.1mm |
| 7 | FPC Thickness | 0.08~0.4mm+ |
| 8 | TPC Thickness Tolerance |
FPC Thickness≤0.3mm: ±0.03mm
FPC Thickness>0.3mm: ±10%~15%
|
| 9 | Types of Copper Foil | Rolled Copper Foil/Electrode Posited Copper |
| 10 | Copper Thickness | 0.5oz, 1oz, 1.5oz, 2oz |
| 11 | Min Tracing/Spacing | ≥2mil |
| 12 | Grid line Tracing/Spacing |
≥0.1mm |
| 13 | Soldering Pad Diameter | ≥0.3mm |
| 14 | Lead Time | 5-7 days |
| 15 | Coverlay | Yellow, White, Black, None |
| 16 | Coverlay Opening Size | ≥0.6mm*0.6mm |
| 17 | Min Spacing Colverlay to Soldering Pad | ≥0.15mm |
| 18 | Soldermask Color | Green and others |
| 19 | Soldermask Bridge |
Green: ≥0.1mm
Others: ≥0.15mm
|
| 20 | Min Width of Soldermask and Soldering Pad
|
Green: ≥0.08mm
Others: ≥0.2mm
|
| 21 | Silkscreen | White, Black, None |
| 22 | Minimum Character Width (Legend) | ≥0.8mm |
| 23 | Minimum Character Height (Legend) | ≥0.8mm |
| 24 | Min Spacing from Silkscreen to Soldering Pad |
≥0.2mm |
| 25 | Surface Finish | ENIG, OSP, Immersion Tin, Chemical Silver |
| 26 | Impedance Control | Single-ended 50Ω, Differential Pairs100Ω, Tolerance ±10% |
| 27 | Stiffener Material | PI, FR-4, Aluminum, Steel, Copper |
| 28 | Stiffener Thickness | 0.1~0.5mm |
| 29 | Edge Rail Width | ≥10mm |
| 30 | Other Options | 3M Tape, EMI Shielding Film |
| 31 | Certification | ISO9001, RoHS |
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