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FR-4 PCB

An FR-4 PCB refers to a Printed Circuit Board (PCB) that uses FR-4 material as its substrate. FR-4 is a very common composite material used in PCB manufacturing. Its full name is Flame Retardant 4, indicating it meets a specific flame retardancy rating. This material consists of woven fiberglass cloth impregnated with epoxy resin, offering good electrical insulation properties, mechanical strength, and flame retardancy.

Here are some key characteristics of an FR-4 PCB:

● Flame Retardancy
 Electrical Performance
 Mechanical Strength
 Thermal Performance
 Cost-effectiveness

FR-4 PCB Capabilities

No. Item Manufacturing Capabilities
1 Material FR-4 (Fiberglass)
2 Number of Layers
1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers,10 Layers
3 TG Grade TG130~140, TG150~160, TG170~180
4 Max PCB Size
1 layer & 2 layers: 1200*300mm or 600*500mm
Multi-layers: 600*500mm
5 Min PCB Size 5mm*5mm
6 Board Size Tolerance(Outline)
±0.2mm(CNC routing)
±0.5mm(V-scoring)
7 Surface Finish HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None
8 Board Thickness
1 Layer/2 Layers: 0.2~2.4mm
4 Layers: 0.4~2.4mm
6 Layers: 0.8~2.4mm
8 Layers: 1.0~2.4mm
10 Layers: 1.2~2.4mm
Note: Customized PCB thickness and Layer stackup are acceptable.
9 Board Thickness Tolerance
Thickness≥1.0mm: ±10%
Thickness<1.0mm: ±0.1mm

Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
10 Outer Layer Copper Thickness
1oz/2oz/3oz
(35μm/70μm/105μm)

Note: 
2oz
PCB thickness≥1.2mm,Via Size≥0.25mm,Min Track/Spacing≥0.15mm
 
3oz
PCB thickness≥2.0mm,Via Size≥0.3mm,Min Track/Spacing≥0.2mm
11 Inner Layer Copper Thickness
1oz/1.5oz
(35μm/50μm)
12 Outer layer Min track/spacing ≥3mil
13 Inner layer Min track/spacing ≥4mil
14  Annular Ring Size ≥0.13mm
15 Grid Line track/spacing ≥0.2mm
16 Coil board Line track/spacing ≥0.2mm
17 BGA pad size
≥0.25mm
18 BGA Distance ≥0.12mm
19 Board Outlines
Track to Outline: ≥0.3mm 
Trace to V-cut line: ≥0.4mm
20 Finished Hole Size Tolerance ±0.08mm
21 Finished Hole Diameter(CNC)
0.2mm~6.3mm
               
1. PCB Thickness=2.0mm, Min Hole Size Is 0.3mm
2. PCB Thickness=2.4mm, Min Hole Size Is 0.4mm
3. Copper Thickness=2OZ, Min Hole Size Is 0.25mm
4. Copper Thickness=3OZ, Min Hole Size Is 0.3mm
22 TH Via Distance
Same nets: 0.15mm

Different net: 0.25mm
23 Plated Slot Size
≥0.5mm

Note:
L:W=2.5: 1 (Should be 2.5:1 or Higher. If It Is Less Than This, The Holes May Be Misaligned.)  If You Can't Draw A Long Hole In Your Design, You Can Draw A Continuous Round Hole And It Will Be Regarded As A Long Hole. Also, It Is Okay To Draw The Oblong Hole In Profile Layer Instead Of  Drilling Layer.
24 Castellated Holes ≥0.6mm
25 Non-Plated Holes ≥0.8mm
26 NPTH to Copper Line ≥0.2mm
27 Soldermask Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None
28 Soldermask Thickness 20~30um
29 Soldermask Bridge
Green: ≥0.1mm

Others: ≥0.15mm
30 Soldermask to soldering pad distance ≥0.05mm
31 Silkscreen White, Black, Yellow, None
32 Minimum Character Width(Legend)
≥0.15mm

Note: Characters of less than 0.15mm wide will be too narrow to be identifiable.
33 Minimum Character Height (Legend)
≥0.75mm

Note: Characters of less than 0.8mm high will be too small to be recognizable.
34 Character Width to Height Ratio (Legend) 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio)
35 Silkscreen to Soldering Pad Distance ≥0.1mm
36 V-cut Line
≥70mm

Note:
PCB thickness≥0.6mm
37 V-cut Line Distance ≥3.5mm
38 Distance betwen Board to Board ≥0.8mm
39 Stamp-hole Width
≥2.0mm

Note: PCB size and thickness are subject to review by Minintel.
40 Tab-route Width
≥1.6mm

Note: PCB size and thickness are subject to review by Minintel.
41 Edge Rail
≥3.5mm

Note: If the pannels are arrayed  by Minintel, we will add 5mm edge rails on both sides by default.
42 Gold Finger
Bevelling Angle: 30~45°
Depth: ≥1mm
Length: 45mm~280mm

Note: Board thickness≥1.2mm
43 Special Specification
Impedance control

Custom Layer Stackup

Interstitial Via Hole(IVH)

Via in pad

Via filled with resin

Countersinks/Counterbores

Carbon Mask

Halogen-Free

Z-axis milling

Edge Plating

Others

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