FR-4 PCB

An FR-4 PCB refers to a Printed Circuit Board (PCB) that uses FR-4 material as its substrate. FR-4 is a very common composite material used in PCB manufacturing. Its full name is Flame Retardant 4, indicating it meets a specific flame retardancy rating. This material consists of woven fiberglass cloth impregnated with epoxy resin, offering good electrical insulation properties, mechanical strength, and flame retardancy.

Here are some key characteristics of an FR-4 PCB:

● Flame Retardancy

● Electrical Performance

● Mechanical Strength

● Thermal Performance

● Cost-effectiveness

FR-4 PCB Capabilities

No.	Item	Manufacturing Capabilities
1	Material	FR-4 (Fiberglass)
2	Number of Layers	1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers,10 Layers
3	TG Grade	TG130~140, TG150~160, TG170~180
4	Max PCB Size	1 layer & 2 layers: 1200300mm or 600500mm Multi-layers: 600*500mm
5	Min PCB Size	5mm*5mm
6	Board Size Tolerance(Outline)	±0.2mm(CNC routing) ±0.5mm(V-scoring)
7	Surface Finish	HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None
8	Board Thickness	1 Layer/2 Layers: 0.2~2.4mm 4 Layers: 0.4~2.4mm 6 Layers: 0.8~2.4mm 8 Layers: 1.0~2.4mm 10 Layers: 1.2~2.4mm Note: Customized PCB thickness and Layer stackup are acceptable.
9	Board Thickness Tolerance	Thickness≥1.0mm: ±10% Thickness<1.0mm: ±0.1mm Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
10	Outer Layer Copper Thickness	1oz/2oz/3oz (35μm/70μm/105μm) Note: 2oz PCB thickness≥1.2mm,Via Size≥0.25mm,Min Track/Spacing≥0.15mm 3oz PCB thickness≥2.0mm,Via Size≥0.3mm,Min Track/Spacing≥0.2mm
11	Inner Layer Copper Thickness	1oz/1.5oz (35μm/50μm)
12	Outer layer Min track/spacing	≥3mil
13	Inner layer Min track/spacing	≥4mil
14	Annular Ring Size	≥0.13mm
15	Grid Line track/spacing	≥0.2mm
16	Coil board Line track/spacing	≥0.2mm
17	BGA pad size	≥0.25mm
18	BGA Distance	≥0.12mm
19	Board Outlines	Track to Outline: ≥0.3mm Trace to V-cut line: ≥0.4mm
20	Finished Hole Size Tolerance	±0.08mm
21	Finished Hole Diameter(CNC)	0.2mm~6.3mm 1. PCB Thickness=2.0mm, Min Hole Size Is 0.3mm 2. PCB Thickness=2.4mm, Min Hole Size Is 0.4mm 3. Copper Thickness=2OZ, Min Hole Size Is 0.25mm 4. Copper Thickness=3OZ, Min Hole Size Is 0.3mm
22	TH Via Distance	Same nets: 0.15mm Different net: 0.25mm
23	Plated Slot Size	≥0.5mm Note: L:W=2.5: 1 (Should be 2.5:1 or Higher. If It Is Less Than This, The Holes May Be Misaligned.) If You Can't Draw A Long Hole In Your Design, You Can Draw A Continuous Round Hole And It Will Be Regarded As A Long Hole. Also, It Is Okay To Draw The Oblong Hole In Profile Layer Instead Of Drilling Layer.
24	Castellated Holes	≥0.6mm
25	Non-Plated Holes	≥0.8mm
26	NPTH to Copper Line	≥0.2mm
27	Soldermask	Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None
28	Soldermask Thickness	20~30um
29	Soldermask Bridge	Green: ≥0.1mm Others: ≥0.15mm
30	Soldermask to soldering pad distance	≥0.05mm
31	Silkscreen	White, Black, Yellow, None
32	Minimum Character Width(Legend)	≥0.15mm Note: Characters of less than 0.15mm wide will be too narrow to be identifiable.
33	Minimum Character Height (Legend)	≥0.75mm Note: Characters of less than 0.8mm high will be too small to be recognizable.
34	Character Width to Height Ratio (Legend)	1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio)
35	Silkscreen to Soldering Pad Distance	≥0.1mm
36	V-cut Line	≥70mm Note: PCB thickness≥0.6mm
37	V-cut Line Distance	≥3.5mm
38	Distance betwen Board to Board	≥0.8mm
39	Stamp-hole Width	≥2.0mm Note: PCB size and thickness are subject to review by Minintel.
40	Tab-route Width	≥1.6mm Note: PCB size and thickness are subject to review by Minintel.
41	Edge Rail	≥3.5mm Note: If the pannels are arrayed by Minintel, we will add 5mm edge rails on both sides by default.
42	Gold Finger	Bevelling Angle: 30～45° Depth: ≥1mm Length: 45mm～280mm Note: Board thickness≥1.2mm
43	Special Specification	Impedance control Custom Layer Stackup Interstitial Via Hole(IVH) Via in pad Via filled with resin Countersinks/Counterbores Carbon Mask Halogen-Free Z-axis milling Edge Plating Others

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