FR-4 PCB Capabilities
FR-4 PCB Capabilities | ||
NO. |
Item |
Manufacturing Capabilities |
1 |
Material |
FR-4 |
2 |
Number of Layers |
1 Layer / 2 Layers / 4 Layers / 6 Layer / 8 Layers / 10 Layers / 12 Layers |
3 |
TG Grade |
TG130-140 / TG150-160 / TG170-180 |
4 |
Max PCB Size |
1-2 layers: 1200*300mm / 600*500mm Multi-layers: 600*500mm |
5 |
Min PCB Size |
5mm*5mm |
6 |
Board Size Tolerance(Outline) |
±0.2mm(Milling) ±0.5mm(V-CUT) |
7 |
Surface Finish |
HASL with lead / HASL lead free / Immersion gold OSP / Hard gold / ENEPIG / Immersion silver / None |
8 |
Board Thickness |
1 Layer/2 Layers: 0.2-2.4mm 4 Layers: 0.4-2.4mm 6 Layers: 0.8-2.4mm 8 Layers: 1.0-2.4mm 10 Layers: 1.2-2.4mm |
9 |
Board Thickness Tolerance |
Thickness≥1.0mm: ±10% Thickness<1.0mm: ±0.1mm |
10 |
Outer Layer Copper Thickness |
1oz/2oz/3oz |
11 |
Inner Layer Copper Thickness |
1oz/1.5oz |
12 |
Soldermask |
Green / Red / Yellow / White / Black / Blue / Purple / None |
13 |
Soldermask Thickness |
20-30um |
14 |
Soldermask Bridge |
Green: ≥0.1mm Others: ≥0.15mm |
15 |
Soldermask to soldering pad distance |
≥0.05mm |
16 |
Silkscreen |
White / Black / Yellow / None |
17 |
Minimum Character Width |
≥0.15mm |
18 |
Minimum Character Height |
≥0.75mm |
19 |
Silkscreen to Soldermask Distance |
≥0.1mm |
20 |
V-cut Line |
≥75mm |
21 |
V-cut Line Distance |
≥3.5mm |
22 |
Outer layer Min track/spacing |
≥0.0762mm |
23 |
Inner layer Min track/spacing |
≥0.1mm |
24 |
Annual ring size |
≥0.13mm |
25 |
Grid Line track/spacing |
≥0.2mm |
26 |
Coil board Line track/spacing |
≥0.2mm |
27 |
BGA pad size |
≥0.2mm |
28 |
BGA Distance |
≥0.12mm |
29 |
Board Outlines |
Track to Outline: ≥0.3mm Trace to V-cut line: ≥0.4mm |
30 |
Finished Hole Size Tolerance |
±0.08mm |
31 |
Finished Hole Diameter(CNC) |
0.2mm-6.3mm |
32 |
TH Via Distance |
Equipotential: 0.15mm Isoelectric: 0.25mm |
33 |
Plated Slot Size |
≥0.5mm |
34 |
Castellated Holes |
≥0.6mm |
35 |
Non-Plated Holes |
≥0.8mm |
36 |
NPTH to Copper Line |
≥0.2mm |
37 |
Distance betwen Board to Board |
≥0.8mm |
38 |
Stamp-hole Width |
≥2.0mm |
39 |
Tab-route Width |
≥1.6mm |
40 |
Edge Rail |
≥3.5mm |
41 |
Gold Finger |
Bevelling Angle: 30-45° Depth: ≥1mm Length: 45mm-280mm |
42 |
Special Specification |
Impedance control Custom Layer Stackup Interstitial Via Hole(IVH) Via in pad Via filled with resin Countersinks / Counterbores Carbon Mask Halogen-Free Z-axis milling Edge Plating |