Kikowaena ʻike

1. Nā Kumu a me nā Pōmaikaʻi o ka ALDAtomic Layer Deposition (ALD) hoʻohana iā ia iho i ka palena ʻana o ka ʻili e waiho i nā kiʻiʻoniʻoni lahilahi conformal (conformality>95%) ma o nā pulupulu precursor alternating (eg, Cu(hfac)₂, H₂O). No ka ratio hiʻohiʻona kiʻekiʻe (AR>10:1) ma o...

ʻO nā papa ana wela hoʻoheheʻe Reflow he mea pono loa ia i ka ʻoihana hana uila. Ma ka hoʻonohonoho ʻana i nā helu ana wela ma ka papa a me ka hoʻokomo ʻana i nā mea ʻike wela, hiki iā lākou ke nānā i ka manawa maoli o ka tempe...

1. ʻO ka wehewehe a me ka hoʻololi ʻana i nā kumu o ka Sintering ShrinkageSintering shrinkage (ΔL/L₀) e pili ana i ka hoʻololi ʻana o ka laina laina o nā substrates LTCC i ke kī ʻana, koʻikoʻi no ka alignment multilayer a me ka hana ʻana o ka mea hana. Loaʻa nā kumu nui: Mate...

1. Nā Kumu a me nā Pono o LIFTLaser-Induced Forward Transfer (LIFT) hoʻohana i nā lasers pulsed (UV-NIR, e laʻa, 355 nm, 1064 nm) no ka nānā ʻana i kahi kiʻiʻoniʻoni hāʻawi, e hoʻoulu ai i ka hoʻololi a i ʻole ka vaporization. ʻO ka hopena haʻalulu e hoʻoneʻe i ka hoʻoili waiwai i kahi ...

I. Solder Paste Use Control E hahai i ke kumu mua - in - first - out. Ma hope o ka hōʻea ʻana o ka paʻi solder i ka hale hana, e hoʻopili koke i ka "Solder Paste Usage Control Label" a mālama i loko o ka friji ma 2 - 8°C. E hoʻohana i ka ʻae hoʻopili solder...

1. Koʻikoʻi a me nā Luʻi o ka Tension ControlIn R2R flexible PCB production, tension control of film substrates (eg, PI, PET) pili pono: Dimensional stability: Unneven haʻalulu ke kumu o ka hoʻopololei ʻana, alakaʻi i ka misalignment; Kaʻina...

1. Nā Kumu Nui o ka Capacitance Deviation ʻO ka hoʻomanawanui ʻana (maʻamau i loko o ± 10%) e hoʻololi ʻia e: ʻO ka hoʻololi ʻana o nā mea dielectric: ʻO nā ʻokoʻa o ka Batch-to-batch ma Dk a me ka mānoanoa; Kaʻina hana hoʻoheheʻe: ʻAʻole like ka lamination kaomi/mahana...

ʻO ka nānā ʻana i ka manawa maoli o ka BGA Solder Joint Fatigue māwae ma o Acoustic Emission Technology.

I loko o ka hana PCB non-halogen, ʻo ke kaupaona ʻana i ka lapalapa ahi a me ka hana dielectric he paʻakikī paʻakikī, e pili ana i ke koho ʻana i nā mea, ka loiloi kaʻina hana, a me ka hoʻāʻo hana. ʻO kēia ka ʻike kikoʻī: Sele...

ʻO ka hoʻolālā ʻana o ka Dynamic Scheduling i nā laina hana PCB i loko o nā hale hana akamai 1. Nā pahuhopu kumu o ka Dynamic Scheduling Optimization ʻO nā pahuhopu mua e hoʻokaʻawale i nā kumuwaiwai me ka maikaʻi, hoʻemi i nā manawa alakaʻi, hoʻomaikaʻi i ka hoʻohana ʻana i nā mea hana, a wikiwiki res ...