Amaphuzu Abalulekile Okulawula Inqubo Enqubweni Yokuphrinta Ye-SMT Solder Paste

I. Ukulawula Ukusetshenziswa Kwe-Solder Paste

• Landela isimiso sokuqala - ngaphakathi - kuqala - ukuphuma. Ngemva kokuba i-solder paste ifikile efektri, faka ngokushesha i-"Solder Paste Use Control Label" bese uyigcina esiqandisini ku-2 - 8°C. Sebenzisa i-solder paste ngokwesikhathi sokuphelelwa yisikhathi ngokulandelana. Thatha i-solder paste enenombolo encane kuqala. Vumela i-solder paste ifudumale ebhokisini elingangeni umswakama isikhathi esingaphezu kwamahora angu-4 ngaphambi kokusebenzisa. Gcwalisa ifomu lokulawula i-solder paste uma uthatha i-solder paste.

II. Ukulawulwa Kokushisa Kwesiqandisi

• Izinga lokushisa lesiqandisi kufanele ligcinwe ku-2 - 8°C. Uma izinga lokushisa lingavamile, phatha isimo bese ugcwalisa "Ifomu Lerekhodi Lokuphathwa Kokungavamile Kokushisa Kwesiqandisi".

III. Ukulawulwa Kokwengeza I-Solder Paste

1. Setha kusengaphambili inani lezikhathi zokuphrinta komshini ngokusekelwe enanini le-solder paste esetshenziswe kuphaneli eyodwa yesiciI-IC imodeli. Engeza i-solder paste njengoba kudingeka, qinisekisa inani le-solder, bese ugcwalisa "Ifomu Lokuhlola Nokwengeza I-Solder Paste".
2. Gcina i-blade yokuxuba yepulasitiki yokufaka i-solder paste ihlanzekile.
3. Sebenzisa i-solder paste evuliwe zingakapheli amahora angama-24. I-solder paste engavulwanga ingagcinwa endaweni engaphakathi isikhathi esingaphansi kwenyanga eyi-1. Yilahle uma idlula isikhathi sokugcina.

IV. Ukulawulwa Kwe-Stencil

1. Ukuhlanza Istencil: Hlanza istencil ngaphambi kokusebenzisa i-inthanethi, njalo emahoreni ayisithupha ngesikhathi sokuyisebenzisa, nalapho umugqa wokukhiqiza umile imizuzu engama-30 ehlanganisiwe.
2. Ukuhlolwa Kokuhlanza I-Stencil: Hlola i-stencil ngemva kokuhlanza ukuqinisekisa ukuthi akukho zinsalela ze-solder paste ezindongeni zemigodi futhi akukho monakalo ku-stencil.
3. Ukulawula Ukucindezeleka: Kala ukucindezeleka ngemitha yokucindezela ngemva kokuhlanza ngakunye lapho usebenzisa i-inthanethi futhi ungaxhunyiwe ku-inthanethi. Ukucindezeleka kufanele kube ngu-≤ - 0.21mm noma ≥ 32N/cm.
4. I-stencil I-SCRUkulawula i-ap: Khuhla i-stencil uma isifinyelele izikhathi ezingu-150,000 zokusetshenziswa (kubalwa nge-PCS/ukusetshenziswa) noma yonakele.
5. Inqubo Yokuhlanza I-Stencil: Lawula ukungena nokuphuma kwama-stencil usebenzisa uhlelo lwe-MES.

V. Ukulungiswa Kokubekwa Kwe-PCB

VI. Ukulawulwa Kokucindezela

1. Ukuphathwa kwe-Squeegee: Sebenzisa uhlelo lwe-MES ukulawula yonke imisebenzi lapho i-squeegee ingena ku-inthanethi futhi ingaxhunyiwe ku-inthanethi.
2. Ukuhlanza Nokulungisa: Hlanza i-squeegee ngemva kokuba ingasebenzi. Hlola ukuthi ayinawo yini umonakalo ngemva kokuhlanza.
3. Ukulawula Okusikiwe: Shintsha i-squeegee ngentsha ngemva kokusetshenziswa izikhathi ezingu-150,000 (noma uma yonakele).

VII. Ukuhlanzwa kwe-PCB

VIII. Ukulawula Ukuphrinta Nge-Solder Paste

1. Umshini we-SPI uthola ngokuzenzakalelayo (ukujiya, indawo, ivolumu, i-short - circuit, ukuphrinta okungekho, i-offset) bese uqopha ibhodi ngalinye.
2. Uma i-SPI ingakwazi ukuqaphaI-RFUma kwenzeka ukutholwa ngenxa yokungabikho komshini we-SPI noma ezinye izizathu ezingavamile, hlola ngokungahleliwe ngabasebenzi. Hlola ngokubonakalayo ukuphrinta kwe-solder paste (akukho mjikelezo omfushane, akukho ukuphrinta okungekho, akukho offset noma offset
3. Ubukhulu be-Solder Paste kanye nokulawula ivolumu:
   • Ububanzi Bokulawula Ubukhulu Bokunamathisela I-Solder: (Umshini we-SPI ulawula kakhulu ivolumu, futhi ubukhulu bungokwereferensi esekelayo.)
     • a. Kwe-0.5 mm Pitch CSP / Micro BGA: T - 0.005mm ~ T + 0.055mm
     • b. Nge-0.5 mm Pitch QFP / QFN: T - 0.005mm ~ T + 0.055mm
     • c. Kwe-0.8 - 1.0 mm Pitch BGA/ CSP: T - 0.005mm ~ T + 0.065mm
     • d. Nge-Normal Chip (RLC nabanye): T - 0.005mm ~ T + 0.085mm (Isaziso: T = ubukhulu be-stencil)
   • Ukulawulwa Kwevolumu Yokunamathisela I-Solder (kokulinganisa umshini we-SPI):
     • a. Nge-0.5 mm Pitch CSP / Micro BGA: 0.0016387 ~ 0.008194mm³
     • b. Kwe-CSP/Micro BGA 0.65 - 0.8mm: 0.0065548 ~ 0.029497mm³
     • c. Kwe-CSP/PBGA/Micro BGA 1.0mm: 0.0163871 ~ 0.081935mm³
     • d. Bheka okunamathiselwe okulandelayo ukuze uthole ukulawula ivolumu kwezinye izingxenye.

• • Uma usebenzisa i-SPI ukuhlola ikhwalithi yokuphrinta kwe-solder paste, umqhubi kufanele aqaphele futhi aqophe inani le-CPK kanye nobukhulu obumaphakathi njalo emahoreni ama-2.