Iṣeyọri Agbegbe Ooru-Ooru (HAZ) Iṣapẹẹrẹ Fọọlu Ejò nipasẹ Femtosecond Laser Ablation

1. Awọn ilana ati Awọn anfani ti Femtosecond Laser Ablation

Awọn lesa Femtosecond (iwọn pulse 10⁻¹⁵) jẹ ki gbigba aiṣedeede ṣiṣẹ (fun apẹẹrẹ, ionization multiphoton, ionization avalanche) pẹlu HAZ nitosi-odo nitori:

• Non-gbona kẹwa si: Ififunni agbara yiyara ju itọka ooru lọ (Cu akoko itọka igbona≈1 ps);

• Ga konge: Ipinnu Submicron (ila ila

• Iyipada ohun elo: Dara fun awọn irin ti o ṣe afihan (Cu), awọn ohun elo ti o han, ati awọn akojọpọ.

2. Awọn Ilana Ilana bọtini

(1) Lesa paramita

• Igi gigun: UV (343/515 nm) fun gbigba ti o ga julọ Cu (≈40% vs. IR 5%);

• Pulse agbara & fluence: 0.1–10 μJ/pulse, fluence=1–5 J/cm² (nitosi Cu ablation ala).

(2) Iṣakoso ina & Ṣiṣayẹwo

• Optics idojukọ: Awọn ibi-afẹde giga-NA (NA≥0.5) fun iwọn iranran 1-5 μm;

• Awọn ilana ọlọjẹ: Ajija/ayẹwo raster, iyara = 1-10 m/s, ≤3 kọja lati dinku titẹ sii ooru.

(3) Iṣakoso Ayika

• Gaasi Inert (Ar/N₂): Dinku ifoyina (dada O

• Igbale (: Suppresses pilasima shielding.

3. Mechanisms fun Zero HAZ

• Electron-latice decoupling: Agbara ti a fi si awọn elekitironi, idilọwọ itọka igbona;

• Alakoso bugbamu alakoso: Taara sublimation / pilasima Ibiyi yago fun yo;

• Gbigbọn ikojọpọ ooru: Pulse aarin (> 10 ns) kọja akoko itutu elekitironi (≈1 ps).

4. Afọwọsi

• Maikirosikopi: SEM/TEM ṣe afihan ko si yo tabi ipalọlọ lattice (iwọn HAZ

• Iṣiro kemikali: XPS jẹrisi sisanra oxide

• Awọn idanwo iṣẹ-ṣiṣe:

  • Iṣeṣe: Resistivity≈1.7 μΩ · cm (bii olopobobo);

  • Iduroṣinṣin gbona: Ko si idagbasoke HAZ lẹhin 300 ° C annealing.

5. Awọn italaya & Awọn ojutu

• Ipenija 1: ga reflectivity:

  • Ojutu: Abojuto ifojusọna ti a bo (fun apẹẹrẹ, 10 nm Ti) tabi polarization ipin.

• Ipenija 2: Pilasima shielding:

  • Ojutu: Sisẹ igbale tabi oṣuwọn atunwi kekere (

• Ipenija 3: Ilọsiwaju kekere:

  • OjutuTi o jọra olona-tan ina processing (DMD/SLM).

6. Awọn ohun elo & aje

• Awọn PCB-igbohunsafẹfẹ: Awọn eriali 28 GHz pẹlu pipadanu

• Awọn ẹrọ itanna rọ: Awọn ilana Cu ti o da lori PI duro> 10⁵ bends (R=1 mm);

• Awọn ifowopamọ iye owo: 90% kere kemikali egbin la lithography, 5× yiyara processing.