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Imudara Adhesion Ejò Alailowaya lori Awọn sobusitireti PTFE nipasẹ Itọju Plasma Tutu

Imudara Adhesion Ejò Alailowaya lori Awọn sobusitireti PTFE nipasẹ Itọju Plasma Tutu

2025-04-05
1. PTFE Dada Awọn italaya Agbara kekere ti PTFE (18-24 mN / m) ati inertness kemikali yorisi: Adhesion ti ko lagbara: Aini awọn ẹgbẹ iṣẹ ṣiṣe fun isunmọ kemikali; Ailokun tutu: Igun olubasọrọ> 110 °; Ibamu CTE: PTFE (100&nd...
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Cleaning High Aspect Ratio Nipasẹ-Iho Lilo Supercritical CO₂ omi

Cleaning High Aspect Ratio Nipasẹ-Iho Lilo Supercritical CO₂ omi

2025-04-02
1. Awọn ohun-ini ati Awọn anfani ti Supercritical CO₂ Supercritical CO₂ (scCO₂) daapọ gaasi-bi diffusivity (≈10⁻⁷ m²/s) ati omi-bi agbara ojutu (parameter solubility≈0.5–2.5 (cal/cm³)¹/² rẹ
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Titunṣe PCB Ejò Layer abawọn nipasẹ Tutu sokiri Technology

Titunṣe PCB Ejò Layer abawọn nipasẹ Tutu sokiri Technology

2025-04-01
1. Awọn ilana ati Awọn anfani ti Cold Spray Cold Spray jẹ ilana isọdi-ipinle ti o lagbara nibiti awọn irin lulú (fun apẹẹrẹ, Cu) ti wa ni iyara nipasẹ gaasi ti o ga (N₂ / He) si awọn iyara supersonic (300-1200 m / s), ti o n ṣe awọn aṣọ wiwu nipasẹ abuku ṣiṣu ...
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Imukuro Awọn iṣẹku Microbubble ni Awọn igbimọ Multilayer nipasẹ Ilana Lamination Vacuum

Imukuro Awọn iṣẹku Microbubble ni Awọn igbimọ Multilayer nipasẹ Ilana Lamination Vacuum

2025-03-31
1. Awọn okunfa ati Awọn ipa ti MicrobubblesMicrobubbles (1-50 μm voids) ti a ṣe nipasẹ gaasi idẹkùn lakoko idinku lamination: Iṣẹ itanna: Alekun dielectric pipadanu (fun apẹẹrẹ, +0.005 tanδ ni 10 GHz); Agbara ẹrọ: 30–50% pupa...
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Ipa Ipa-egungun Aja ni Ipin Iwọn-giga (> 20: 1) Electroplating nipasẹ iho

Ipa Ipa-egungun Aja ni Ipin Iwọn-giga (> 20: 1) Electroplating nipasẹ iho

2025-03-30
Aja-egungun Ipa ntokasi si awọn lasan ibi ti awọn plating sisanra ni nipasẹ ẹnu-ọna ati ijade jẹ significantly tobi ju aarin agbegbe nigba ga-aspect-ipin nipasẹ-iho electroplating. Eyi waye lati gbigbe iwọn elekitiroti lopin ati une ...
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Tipa Kirkendall Ipilẹṣẹ Ofo ni SAC305 (Sn-Ag-Cu) Awọn isẹpo Solder

Tipa Kirkendall Ipilẹṣẹ Ofo ni SAC305 (Sn-Ag-Cu) Awọn isẹpo Solder

2025-03-29
Awọn ofo Kirkendall, ti o ṣẹlẹ nipasẹ awọn oṣuwọn itọka atomiki iyatọ, ni itara ba igbẹkẹle apapọ solder di. Awọn ilana pataki lati dinku idasile wọn ni SAC305 (Sn-3.0Ag-0.5Cu) pẹlu: 1. Alloy Composition Optimization Trace alloying element: ...
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Ṣiṣe awọn Resistors Imudanu Ti o gaju-giga nipasẹ Aerosol Jet Printing Technology

Ṣiṣe awọn Resistors Imudanu Ti o gaju-giga nipasẹ Aerosol Jet Printing Technology

2025-03-28
1. Awọn Ilana ati Awọn anfani ti Aerosol Jet PrintingAerosol Jet Printing (AJP) awọn inki iṣẹ-ṣiṣe bi micron-scale aerosols (1-5 μm) nipa lilo ifọkansi gaasi apofẹlẹfẹlẹ, ṣiṣe: Iwọn giga: 10 μm linewidth with ± 2 μm placement ac ...
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Iṣeyọri Awọn isopọ Inaro ni Awọn akopọ 2.5D/3D nipasẹ Nipasẹ-Silicon Nipasẹ (TSV) Imọ-ẹrọ

Iṣeyọri Awọn isopọ Inaro ni Awọn akopọ 2.5D/3D nipasẹ Nipasẹ-Silicon Nipasẹ (TSV) Imọ-ẹrọ

2025-03-25
1. TSV Fundamentals ati 2.5D/3D Architectures Nipasẹ-Silicon Via (TSV) kí awọn inaro interconnects nipasẹ ohun alumọni sobsitireti, lominu ni fun ërún stacking (3D) tabi interposer-orisun Integration (2.5D). Awọn anfani bọtini pẹlu: Awọn ọna asopọ kukuru: TSVs...
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Ṣiṣeto Iṣakojọpọ Layer aibaramu fun Awọn igbimọ Isopọmọra iwuwo Giga

Ṣiṣeto Iṣakojọpọ Layer aibaramu fun Awọn igbimọ Isopọmọra iwuwo Giga

2025-03-24
1. Itumọ ati Awọn Idi ti Asymmetric Stack-upsAsymmetric Layer stack-ups jẹ ki aiṣedeede ifihan agbara, iṣakoso igbona, ati agbara ẹrọ nipasẹ oriṣiriṣi sisanra ohun elo, awọn oriṣi bàbà (fun apẹẹrẹ, RCF, LP), ati awọn iwọn dielectric (Dk). Awọn ibi-afẹde pataki pẹlu...
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SMT Production Aye Management

SMT Production Aye Management

2025-03-23
I. Kini Oju-iwe naa Aaye naa ni awọn eroja meji: "现" (akoko lọwọlọwọ) ati "场" (ipo). "现" n tẹnu mọ igba diẹ, tọka si akoko ti o wa bayi. "场" tẹnumọ agbegbe agbegbe, tọka si aaye ti ara. Apapọ: Aaye naa jẹ ...
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