Amanqaku aphambili oLawulo lweNkqubo kwiNkqubo yokuPrinta i-SMT Solder Paste

I. Ulawulo lokusetyenziswa kweSolder Paste

• Landela umgaqo wokuqala - ngaphakathi - ukuphuma. Emva kokuba intlama yesolder ifikile efektri, ncamathisela ngoko nangoko "Ileyibhile yoLawulo lokusetyenziswa kweSolder Paste" kwaye uyigcine efrijini kwi-2 - 8°C. Sebenzisa intlama yesolder ngokomhla wokuphelelwa ngokulandelelana. Thatha intlama yesolder enenani elincinci kuqala. Vumela intlama yesolder ifudumale kwibhokisi engangenisi manzi kangangeeyure ezingaphezu kwe-4 ngaphambi kokuba uyisebenzise. Zalisa ifomu yokulawula intlama yesolder xa uthatha intlama yesolder.

II. Ulawulo lobushushu befriji

• Ubushushu befriji bufanele bugcinwe kwi-2 - 8°C. Xa ubushushu bungaqhelekanga, jongana nale meko uze ugcwalise "Ifomu yeRekhodi yoKuphatha uBunzima bobushushu beFriji".

III. Ulawulo lokongeza iPaste yeSolder

1. Misela kwangaphambili inani lamaxesha okuprinta komatshini ngokusekelwe kubungakanani bepaste ye-solder esetyenzisiweyo kwiphaneli enye yento ethile.NDIYABONA imodeli. Yongeza intlama yesolder njengoko kufuneka, qinisekisa ubungakanani besolder, uze ugcwalise "iFomu yeRekhodi yoHlolo kunye noQokelelo lweNtlama yeSolder".
2. Gcina iblade yokuxuba yeplastiki yokongeza intlama yesolder icocekile.
3. Sebenzisa i-solder paste evuliweyo zingadlulanga iiyure ezingama-24. I-solder paste engavulwanga ingagcinwa kwindawo engaphakathi ubuninzi benyanga engaphantsi kwe-1. Yilahle ukuba idlula ixesha lokugcina.

IV. Ulawulo lweStencil

1. Ukucocwa kweStencil: Coca istencil ngaphambi kokuba ungene kwi-intanethi, rhoqo emva kweeyure ezi-6 ngexesha lokusetyenziswa, naxa umgca wemveliso uyema imizuzu engama-30.
2. Uhlolo lokuCoca iStencil: Hlola istencil emva kokucoca ukuqinisekisa ukuba akukho ntsalela ye-solder paste eludongeni lwemingxunya kwaye akukho monakalo kwistencil.
3. Ulawulo loxinzelelo: Linganisa uxinzelelo ngesixhobo sokulinganisa uxinzelelo emva kokucoca ngakunye xa usebenzisa i-intanethi nangaphandle kwe-intanethi. Uxinzelelo kufuneka lube yi-≤ - 0.21mm okanye ≥ 32N/cm.
4. Istensile I-SCRUlawulo lwe-ap: Khupha istencil xa ifikelele kwinani eliqokelelweyo lezihlandlo ezili-150,000 zokusetyenziswa (kubalwa ngokwe-PCS/ukusetyenziswa) okanye yonakele.
5. Inkqubo yokucoca iStencil: Lawula ukungena nokuphuma kweestencil usebenzisa inkqubo ye-MES.

V. Uhlengahlengiso lwendawo yePCB

VI. Ulawulo lwe-Squeegee

1. Ulawulo lweSqueegee: Sebenzisa inkqubo ye-MES ukulawula yonke imisebenzi xa i-squeegee ikwi-intanethi kwaye ingaxhunyiwe kwi-intanethi.
2. Ukucoca nokulungisa: Coca i-squeegee emva kokuba ingasebenzi. Jonga ukuba akukho monakalo na emva kokucoca.
3. Ulawulo lweScrap: Buyisela i-squeegee entsha emva kokusetyenziswa kwayo izihlandlo ezili-150,000 (okanye xa yonakele).

VII. Ukucocwa kwePCB

VIII. Ulawulo lokuPrinta iSolder Paste

1. Umatshini we-SPI ubhaqa ngokuzenzekelayo (ubungqingqwa, indawo, ivolumu, i-short- circuit, ushicilelo olungekhoyo, i-offset) kwaye urekhoda ibhodi nganye.
2. Ukuba i-SPI ayikwazi ukusebenzaI-RFokanye ukufumanisa ukuba akukho matshini we-SPI okanye ezinye izizathu ezingaqhelekanga, yenza uhlolo olungacwangciswanga ngabasebenzi. Hlola ngokubonakalayo ukuprintwa kwe-solder paste (akukho mjikelo umfutshane, akukho shicilelo lungekhoyo, akukho offset okanye offset
3. Ubukhulu beSolder Paste kunye noLawulo lweVolume:
   • Uluhlu lweReferensi yoLawulo lokuThintwa kwePaste yeSolder: (Umatshini we-SPI ulawula ikakhulu ngokomthamo, kwaye ubukhulu bungoboncedo lwereferensi.)
     • a. Kwi-0.5 mm Pitch CSP / Micro BGA: T - 0.005mm ~ T + 0.055mm
     • b. Kwi-0.5 mm Pitch QFP / QFN: T - 0.005mm ~ T + 0.055mm
     • c. Kwi-0.8 - 1.0 mm Iphimbo le-BGA/ CSP: T - 0.005mm ~ T + 0.065mm
     • d. Kwi-Normal Chip (RLC kunye nezinye): T - 0.005mm ~ T + 0.085mm (Isaziso: T = ubukhulu bestencil)
   • Ulawulo lweVolumu yeSolder Paste (yokulinganisa umatshini we-SPI):
     • a. Kwi-0.5 mm Pitch CSP / Micro BGA: 0.0016387 ~ 0.008194mm³
     • b. Kwi-CSP/Micro BGA 0.65 - 0.8mm: 0.0065548 ~ 0.029497mm³
     • c. Kwi-CSP/PBGA/Micro BGA 1.0mm: 0.0163871 ~ 0.081935mm³
     • d. Jonga esi sincamathiselo silandelayo ukuze ufumane ulawulo lwevolumu kwezinye izinto.

• • Xa usebenzisa i-SPI ukuhlola umgangatho wokuprinta i-solder paste, umqhubi kufuneka ajonge aze abhale phantsi ixabiso le-CPK kunye nobukhulu obuphakathi rhoqo emva kweeyure ezi-2.