Imfuneko yokuCocwa kwePlasma phambi kokuLanyiswa kweBhodi yeMultilayer
1. Imvelaphi kunye neMiba enguNdoqo Kwimveliso ye-PCB eninzi, iibhondi zangaphakathi ze-lamination, i-prepreg, kunye nefoyile yobhedu phantsi kobushushu/noxinzelelo. Izingcoliso (ioyile, iioksidi, uthuli) kumphezulu phambi kokuba kunyibilike kubangela: Ukuncamathela okubuthathaka kobuso: Kukhokelela kwidelami...
jonga iinkcukacha