I-Copper Core PCB

Ukuhlelwa

Iipleyiti zesiseko sobhedu, njengezinto ezibalulekileyo kwishishini lokuvelisa i-elektroniki, zinokuhlelwa kwiindidi ezininzi ngokusekelwe kwisakhiwo kunye nokusetyenziswa kwazo. Iintlobo eziphambili ziquka:

1. Iibhodi zeSekethe eziprintiweyo zeMetal Core (MCPCBs): Ezi cwecwe zesiseko sobhedu zibonisa isiseko esenziwe kwisinyithi se-thermal conductivity ephezulu, njenge-aluminium okanye ubhedu, kunye neengqimba ze-foil zobhedu ekudalweni kweesekethe ezisetyenziselwa ukukhanyisa kwe-LED, abaguquli bamandla, kunye nezinye izicelo ezifuna ukutshatyalaliswa kokushisa okusebenzayo.

2. Amacwecwe esiseko seCeramic Copper: Ukusebenzisa izinto ze-ceramic njenge-insulating layer kunye ne-copper njenge-conductive layer, ezi zixhobo zesiseko zibonelela ngokugqithisileyo kokuxhathisa kwe-thermal kunye nokufakelwa kombane, ezifanelekileyo kwizixhobo ze-microwave, ukupakishwa kwe-semiconductor, kunye nezinye izicelo eziphezulu ze-frequency.

3. I-Thermoelectrically Sepasted Copper Base Plates: Ukubandakanya itekhnoloji ekhethekileyo yokwahlula i-thermoelectric, bagcina i-thermal conductivity egqwesileyo ngelixa bebonelela nge-insulation yombane, ilungele ulawulo lwe-thermal yezixhobo zombane.

Iinkqubo zokwenziwa kwemveliso

Iinkqubo zokwenza iipleyiti zesiseko sobhedu zibandakanya la manyathelo alandelayo:

1. Ukulungiswa kweSubstrate: Ukukhetha ikopolo ekumgangatho ophezulu okanye enye imathiriyeli efana nentsimbi okanye iiseramikhi njengesubstrate.

2. Ukulungiswa komphezulu: Unyango lwangaphambili lwe-substrate surface ngokucoca kunye ne-etching ukulungiselela ukunamathela okulandelayo kwe-foil yobhedu.

3. Ukudityaniswa kweFoil yeCopper: Ukufakela i-foil yobhedu kwi-substrate phantsi kweqondo lokushisa eliphezulu kunye noxinzelelo ukuze wenze i-conductive layer.

4. Ukugqithiswa kwePatheni kunye nokuTyelwa: Ukusebenzisa i-photolithography, i-laser, okanye ezinye iindlela zokudlulisa iipatheni zesekethe kwi-foil yobhedu kunye nokukhupha iikhemikhali kwiindawo ezingafunekiyo ukudala isiphaluka.

5. UkuQeda komphezulu kunye noKhuseleko: Ukusebenzisa unyango olungaphezulu olufana ne-tin plating, i-OSP (i-Organic Solderability Preservatives), i-ENIG (i-Electroless Nickel Immersion Gold), njl., ukunyusa iipropati ezichasene ne-oxidation kunye nokuthengiswa.

Iimpawu

Iimpawu eziphambili zeepleyiti zesiseko sobhedu ziquka:

1. High Thermal Conductivity: I-conductivity ephezulu ye-thermal yobhedu iyanciphisa ngokufanelekileyo ukushisa okusebenzayo kwizixhobo zombane, ukwandisa ubomi benkonzo.

2. Ukusebenza kakuhle koMbane: Ubhedu obucocekileyo buqinisekisa ukuchasana okuphantsi kunye nokudibanisa kombane okuzinzileyo.

3. Amandla oomatshini: I-Copper kunye ne-alloys yayo ibonisa amandla aphezulu, afanelekileyo kwiimfuno ezahlukeneyo zokucubungula kunye neendibano.

4. Ukunyangwa kokuMhlwa: Unyango olukhethekileyo lunika ukuxhathisa okulungileyo kwi-corrosion kumacwecwe esiseko sobhedu, okwenza ukusebenza kwiindawo ezinzima.

IiNdawo zokuSebenza

Iipleyiti zesiseko sobhedu zifumana ukusetyenziswa okubanzi kumacandelo amaninzi ngenxa yeepropathi zazo ezizodwa:

1. Ezobuchwephesha kunye nezoNxibelelwano: Kwiisekethe eziphezulu ze-frequency, izixhobo ze-microwave, iithegi ze-RFID, kunye nezinye iimveliso, iipleyiti zesiseko sobhedu zibonelela ngeendlela ezithembekileyo zokuhambisa umqondiso kunye nezisombululo zokutshatyalaliswa kobushushu.

2. I-Electronics yeemoto: Kwiinkqubo zokulawula iimoto, izibane ze-LED, kunye nezinye izicelo, ukusebenza kokushisa okuphezulu kokushisa kwamacwecwe esiseko sobhedu kwandisa uzinzo kunye nokhuseleko lwenkqubo.

3. I-Aerospace: Kwiisathelayithi, izixhobo ze-radar, kunye nezinye izixhobo ze-aerospace, ukuthembeka okuphezulu kunye nokukwazi ukumelana neemeko ezigqithisileyo zeepleyiti zesiseko sobhedu zibalulekile.

4. Amandla kunye nokuKhanya: Kwii-inverters zelanga, iinkqubo zokukhanyisa i-LED, kunye nezicelo ezifanayo, amandla okutshatyalaliswa kokushisa okusebenzayo kwamacwecwe esiseko sobhedu aqinisekisa ukuzinza kwenkqubo yexesha elide.