iteanye le rona
Sesotho
English Chinese Simplified French German Portuguese Spanish Russian Japanese Korean Arabic Irish Greek Turkish Italian Danish Romanian Indonesian Czech Afrikaans Swedish Polish Basque Catalan Esperanto Hindi Lao Albanian Amharic Armenian Azerbaijani Belarusian Bengali Bosnian Bulgarian Cebuano Chichewa Corsican Croatian Dutch Estonian Filipino Finnish Frisian Galician Georgian Gujarati Haitian Hausa Hawaiian Hebrew Hmong Hungarian Icelandic Igbo Javanese Kannada Kazakh Khmer Kurdish Kyrgyz Latin Latvian Lithuanian Luxembou.. Macedonian Malagasy Malay Malayalam Maltese Maori Marathi Mongolian Burmese Nepali Norwegian Pashto Persian Punjabi Serbian Sesotho Sinhala Slovak Slovenian Somali Samoan Scots Gaelic Shona Sindhi Sundanese Swahili Tajik Tamil Telugu Thai Ukrainian Urdu Uzbek Vietnamese Welsh Xhosa Yiddish Yoruba Zulu Kinyarwanda Tatar Oriya Turkmen
Leave Your Message
Likarolo tsa Litaba

Ho Rarolla ho Sosobana ha Koporo ho Roll-to-Roll (R2R) Flexible Circuit Production

2025-04-17

Koporo Foil Wrinkling.jpeg

1. Motso Lisosa tsa ho Sosobana

Lintlha tsa bohlokoa tse bakang ho sosobana ha foil ea koporo mekhoeng ea R2R:

  • Ho se leka-lekane ha tsitsipano: Khatello ea maikutlo sebakeng sa heno ka lebaka la likhahla tsa tsitsipano.

  • CTE e sa lumellane: Copper (17 ppm/°C) vs. PI (35 ppm/°C) liphapano tsa katoloso.

  • Mefokolo ea lirolara: Ho se tsamaisane hantle (> 0.01 mm/m) kapa ho silafala ha bokaholimo.

  • Mefokolo ea Lamination: Mocheso o sa tloaelehang / khatello kapa phallo ea resin.

2. Maano a ho Laola

(1) Ts'ebetso ea Ts'ebetso ea Tension

  • Taolo ea tsitsipano e koetsoeng:
    Li-motor tsa servo + lisele tsa mojaro li boloka tsitsipano ka hare ho ± 0.1 N/mm.

  • Khatello ea maikutlo:
    Ho senyeha ha khatello ea maikutlo nakong ea ho khutlela morao (�=�0×(�0/�)�, n=0.8–1.2).

  • Lirolara tse khahlanong le wrinkle:
    Lirolara tse roaloang moqhaka (R=1500 mm bakeng sa bophara ba tepo ba limilimithara tse 500).

(2) Tsamaiso ea Thermal-Mechanical

  • Taolo ea mocheso oa libaka:
    5-8 libaka tse nang le ≤3 ° C gradient (preheat = 80 ° C, main = 180 ° C, pholile = 50 ° C).

  • Ho tšoana ha khatello:
    Li-silicone pads (Shore A 30–50) kapa litsamaiso tsa cushion tsa moea bakeng sa >95% e ts'oanang.

(3) Boenjiniere ba Lintho

  • Koporo e bohlasoa bo tlase:
    Foil e phekotsoeng ka morao (Rz=1–2 μm) e fokotsa khohlano.

  • Substrate pretreatment:
    Ar/O₂ plasma activation (500 W, 30 s) e phahamisa matla a holimo ho 50 mN/m.

  • Ntlafatso ea sekhomaretsi:
    Li-acrylics tsa phallo e phahameng (viscosity

(4) Tlhokomelo ea Lisebelisoa

  • Tekanyo ea lirolara:
    Ho lumellana ha laser beke le beke (± 0.001 mm) le ho hlahloba holim'a metsi (Ra

  • Ho boloka tsamaiso ea koloi:
    Linear guide lubrication le gear backlash adjustment (

3. Tlhokomelo ea Nako ea Sebele

  • Tlhahlobo ea mahlo:
    Lik'hamera tsa ho skena ka mela (5000fps) + li-algorithms tsa CNN li lemoha masoebe a 0.1 mm².

  • Laser profilometry:
    E lekanya ho bata (

  • Litšoantšo tse futhumetseng:
    E hlokomela mocheso (± 2 ° C alamo moeling).

4. Ts'ebetso ea Parameters

Mohato oa Ts'ebetso Key Parameter Sepheo sa Range
Ho kokobetsa tsitsipano Ho nepahala ha tsitsipano ±0.05 N/mm
Mocheso oa lamination. Mocheso o moholo oa libaka 180±2°C
Khatello ea lamination Khatello ea lihlopha 2.5±0.1 MPa
Taper coefficient Tension decay exponent (n) 0.9–1.0
Ho tsamaisana le rolara Axial kheloha

5. Lithuto Tsa Litaba

  • Taba ea 1: 50μm PI + 12μm Cu foil

    • Tharollo: Hasa lirolara + tsitsipano ea taper (n=0.95)

    • Sephetho: Ho sosobana ho fokotsehile ho tloha ho 5% ho ea ho 0.3%, 20% ea lihlahisoa tse phahameng.

  • Taba ea 2: Karolo e phahameng ea maqhubu a LCP

    • Ts'ebetso ea plasma + lamination ea moea

    • Sephetho: Phapang ea Dk