Tlhokahalo ea ho Hloekisa Plasma Pele ho Multilayer Board Lamination

1. Background & Core Mathata

Ka tlhahiso ea multilayer PCB, lamination bonds inner cores, prepreg, le koporo foil tlas'a mocheso / khatello. Lintho tse silafatsang (oli, oxides, lerōle) holim'a bokaholimo pele ho lamination li baka:

• Khomarela e fokolang ea sefahleho: E lebisang ho delamination kapa ho phatloha;

• Botšepehi bo senyehileng ba pontšo: Voids e eketsa tahlehelo ea dielectric (Df) le pontšo ea pontšo;

• E fokotsehile ho tšepahala ha thermo-mechanical: Ho se lumellane ha CTE ho lebisa tlhokomelo khatellong ea maikutlo, ho potlakisa ho hlōleha ha mokhathala.

2. Mekhoa ea ho Hloekisa Plasma

Ho hloekisa plasma ho sebelisa khase e nang le ionized (O₂, N₂, Ar) ho hlahisa mefuta e sebetsang (elektronike, li-ion, radicals) bakeng sa:

• Ho hloekisa ’meleng:

  • E tlosa nanoparticles (

  • Etches holim 'a ho eketsa makgwakgwa (Ra=0.5–2 μm).

• Phetoho ea lik'hemik'hale:

  • Oxidizes organics (mohlala, O₂ plasma e senya oli ho CO₂/H₂O);

  • E hlahisa lihlopha tsa polar (-OH, -COOH), ho phahamisa matla a holim'a metsi (20–30→ 50–70 mN/m).

• Tshebediso ya bokahodimo:

  • E matlafatsa metsi a resin bakeng sa phallo e ntle ea prepreg.

3. Tlhahlobo ea Tlhokahalo

(1) Tlamahano e Ntlafetseng ea Lifahleho

• Lintlha: Matla a peel a eketseha ho tloha ho 0.5 kN / m ho ea ho 1.2-1.5 kN / m (IPC-TM-650 2.4.8);

• Phokotso ea ho hloleha: Kotsi ea delamination e theoha ka 80% (SEM cross-section analysis).

(2) Ts'ebetso e Ntlafetseng ea Dielectric

• Taolo e se nang letho: Sebaka se se nang letho ka mor'a ho hloekisa

• Phokotso ea tahlehelo ea mats'oao: Tahlehelo ea ho kenya e fokotseha ka 0.2–0.3 dB/cm @10 GHz.

(3) Ho tsitsa ha Ts'ebetso

• Ho tšoana: E koahela mehaho e rarahaneng (li-vias tse foufetseng, litsela tse ntle);

• Eco-compliance: E nkela sebaka sa lik'hemik'hale tse bohale (H₂SO₄/H₂O₂), e fokotsa VOC / metsi a litšila.

4. Li-Parameters tsa Ts'ebetso ea Bohlokoa

• Khetho ea khase:

  • O₂: Ho tlosoa ha lintho tse phelang hantle empa ho ka 'na ha eketsa oxidize koporo;

  • Ar/N₂ motsoako: Etching ea 'mele bakeng sa lisebelisoa tse hlokolosi;

  • H₂: E fokotsa li-oxide tse nyane.

• Matla & nako:

  • Matla a RF: 300-1000 W (e itšetlehileng ka kamoreng);

  • Nako: 30-180 sec (ho leka-lekana pakeng tsa ho hloekisa le ho senya).

• Boemo ba vacuum:

  • Khatello ea motheo

5. Litšenyehelo-Melemo & netefatso ea indasteri

• Papiso ea litšenyehelo:

  Mokhoa	CapEx	OpEx	Katleho
  Ho hloekisa plasma	Phahameng	Mahareng	Phahameng
  Ho hloekisa lik'hemik'hale	Tlase	Phahameng	Mahareng
  Lisebelisoa tsa Ultrasonic	Mahareng	Mahareng	Tlase

• Litekanyetso:

  • IPC-6012 e hloka matla a sefahleho ≥0.8 kN/m;

  • Automotive (AEC-Q200) le aerospace (NASA-STD-8739) taelo holim'a pretreatment.

6. Mathata & Tharollo

• Bothata ba 1: Copper over-oxidation:

  • Tharollo: Ar/H₂ mix (4:1) e hatella oxidation;

• Bothata ba 2: Ho tšoana ha phanele e kholo:

  • Tharollo: Multi-electrode arrays kapa conveyorized systems;

• Bothata ba 3: Tefiso e tsitsitseng:

  • Tharollo: Li-ionizers li fokotsa litefiso ho thibela lerōle ho khomarela.