Bohlokoa ba Teko ea PIM (Passive Intermodulation) ho li-PCB tsa High-Frequency

1.Tlhaloso le Mecha ea Meloko

PIM e bolela tlhahiso ea likarolo tse eketsehileng tsa maqhubu ha lipontšo tse peli kapa ho feta li sebelisana ka likaroloana tse sa sebetseng (mohlala, li-connectors, li-antenna, li-trace tsa PCB) ka lebaka la litšobotsi tse sa tloaelehang. Lintho tsena tse sa tsitsang li ka hlaha ka lebaka la bofokoli ba lintho tse bonahalang (mohlala, bofokoli ba koporo), likhokahano tse fokolang, oxidation, kapa khatello ea kelello ea mochini. Li-PCB tsa maqhubu a phahameng, matla a mats'oao a phahameng le lihlopha tse teteaneng tsa maqhubu li holisa tšitiso e bakoang ke PIM (mohlala, ho kena-kenana ha tatellano ea boraro), e ka nyenyefatsang boleng ba puisano.

2.Kameho ea PIM ho li-PCB tsa High-Frequency

• Ponahatso ea Botšepehi: PIM e hlahisa lerata la ka har'a sehlopha, e eketsa ho tsitsa / ho nahanisisa, 'me e fokotsa SNR, e sitisa phetiso ea data e potlakileng.

• Tahlehelo ea Ts'ebetso ea Tsamaiso: Lits'ebetsong tsa 5G le radar, PIM e ka fokotsa kutlo ea moamoheli, ea eketsa litekanyetso tsa liphoso, kapa ea baka mehala e theohileng.

• Tšitiso ea Multi-System: Mehahong ea lisebelisoa tse arolelanoang khafetsa, matšoao a bohata a hlahisoang ke PIM a ka senya lits'ebetso tse ling, a fokotsa matla a marang-rang.

3.Karolo e Bohlokoa ea Tlhahlobo ea PIM

• Khethollo ea Bofokoli le Ntlafatso ea Ts'ebetso: Teko e fumana lintlha tse sa tsitsang ho tsoa ho inhomogeneity ea thepa (mohlala, koporo e thata) kapa mefokolo ea moralo, e tataisang ntlafatso ea ho tsamaisana ha lamination le khetho ea thepa.

• Tlhahlobo ea Lintho: Teko e netefatsa thepa ea dielectric ea li-substrates (mohlala, letoto la Rogers RO4000) ho netefatsa ts'ebetso e tlase ea PIM.

• Ho netefatsa Moralo: Liteko li netefatsa ho ts'oanela ho ts'oana le EMC litseleng tsa bohlokoa (mohlala, lipara tse fapaneng, liphepelo tsa manakana) ho thibela tšitiso e bakoang ke moralo.

4.Mekhoa ea Teko le Maemo

• Tlhophiso: Kenyelletso ea makhetlo a mabeli (mohlala, 20W) e nang le tlhahlobo ea morao-rao e lemoha lihlahisoa tsa intermodulation. Rogers o sebelisa lithapo tsa phetisetso tsa 50Ω tse emeng le likhokahano tse tlase tsa PIM bakeng sa ho pheta-pheta.

• Lintlha tsa bohlokoa: Tsepamisa maikutlo ho litekanyetso tsa boraro tsa intermodulation (IM3), hangata ka tlase ho -150 dBc (mohlala, liteishene tsa cellular base), tse nang le mehlala e mengata ea karolelano ho netefatsa hore ho tšepahala.

• Maemo a Indasteri: Ho lumellana le litloaelo tsa IEC le li-protocol tsa ka hare (mohlala, tlhahlobo ea PIM ea Rogers), e tšehetsoeng ke lisebelisoa tse ikemetseng (li-spectrum/network analyzers).

5.Melemo ea Moruo le ho Tšepahala

• Taolo ea Litšenyehelo: Teko ea pele e fokotsa mosebetsi oa morao-rao oa tlhahiso hape e qoba likopo tsa bareki ka lebaka la ho hlōleha ha puisano.

• Ho Tšepahala Nako E telele: Liteko li tiisa botsitso ba PCB tlas'a maemo a thata (mohlala, ho palama baesekele e futhumetseng, mongobo).