Taolo ea Stress Deformation in Lamination Process for Ultra-Thin Core (

2025-04-16

1.Mathata a Konokono

Li-cores tse tšesaane haholo (

• Khatello ea mocheso: Ho se lumellane ha CTE ho bakoang ke likhahla tsa mocheso;

• Khatello ea mechine: Kabo ea khatello e sa tšoaneng;

• Khatello ea maikutlo e setseng: Resin shrinkage le ho hlaphoheloa elastic;

• Ho thella ha Interlayer: Khohlano e sa lumellaneng le li-interface tsa mantlha / koporo-Prepreg.

2.Taolo ea Mocheso

• Multi-zone dynamic heat:
  Taolo e ikemetseng ea mocheso (±1°C) ho pholletsa le libaka tsa lamination. Bakeng sa mekotla ea copper-core-Prepreg, beha mocheso oa mantlha 5°C holimo ho feta koporo ho lefella CTE.

• Li-profiles tsa mocheso o phahameng:
  Litefiso tsa ho futhumatsa / ho pholile ≤3 ° C / min le ≤2 ° C / min, ka ho latellana. Mocheso o phahameng oa mocheso ≤Tg + 20 ° C bakeng sa lisebelisoa tse tlaase tsa Tg (mohlala, FR-4).

3.Ntlafatso ea Khatello

• Khatello e tsoelang pele:
  0.5 MPa (metsotso e 5) →1.5 MPa (metsotso e 10) → 2.5 MPa (metsotso e 5).

• Ho lekana ha khatello:
  Li-silicone pads (30-50 Shore A) kapa lipoleiti tsa graphite ho fokotsa phapang ea khatello ho ± 5%.

4.Boenjiniere ba Lintho

• CTE e tšoana:
  Phapang ea Core/copper CTE

• Tshebediso ya bokahodimo:
  O₂/N₂ phekolo ea plasma (300 W, 60 s) e phahamisa matla a holim'a metsi ho 50 mN / m bakeng sa ho khomarela hamolemo.

5.Mokhoa oa Vacuum Lamination

• Vacuum control:
  Vacuum ea mantlha (10-100 mbar) bakeng sa ho tlosoa ha macro-void; vacuum e phahameng (

• Tsamaiso ea phallo ea resin:
  Low-viscosity epoxy (

6.Ho Fokotsa Khatello ea Khatello e Meng

• Symmetric stack moralo:
  Botenya ba koporo e leka-lekaneng (

• Ka mor'a ho phekola:
  Ho pholile butle-butle (1°C/min) ka tlas'a 0.5 MPa ho lokolla khatello ea elastic.

7.Tlhokomelo ea Nako ea 'Nete

• Li-sensor tsa FBG:
  Fiber e kentsoeng Bragg gratings monitor strain (1 με resolution).

• Litšoantšo tse futhumetseng:
  Lekola libaka tse hotspots (>5°C phapano) bakeng sa litokiso tse matla.

• Laser profilometry:
  Leqephe la ntoa ka mor'a lamination

8.Lithuto Tsa Litaba

• Taba ea 1: 50μm FR-4 konokono

  • Boemo: 80°C→140°C→50°C (kakaretso ea metsotso e 150)

  • Liphello: Warpage e fokotsehile ho tloha ho 0.5 ho ea ho 0.07 mm / m; matla a ebola >1.0 N/mm.

• Taba ea 2: 75μm PTFE high-frequency konokono

  • Ar plasma activation →220°C lamination @1.8 MPa

  • Liphetho: phapang ea Dk

9.Litaelo tsa Boqapi

• Matlafatso ea nano-cellulose: Elastic modulus > 8 GPa ho thibela ho sosobana.

• Mongolo o ka holimo oa laser: Ra=1–2 μm bakeng sa ho hokahana ka mochini ho li-cores tsa Rogers RO3000.

• Mafahla a dijithale a tsamaisoang ke AI: Matšeliso a boletsoeng esale pele bakeng sa mefuta e fapaneng ea ts'ebetso.