Tlhokahalo ea ho Hloekisa Plasma Pele ho Multilayer Board Lamination
1. Background & Core Issues Ho etsa multilayer PCB, lamination bonds inner cores, prepreg, le copper foil tlas'a mocheso/khatello. Lintho tse silafatsang (oli, oxides, lerōle) holim'a bokaholimo pele ho lamination e baka: Ho fokola ho homarella sefahlehong: Ho lebisa ho delami...
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