Copper Core PCB

Karolelano

Lipoleiti tsa koporo, e le lisebelisoa tsa bohlokoa indastering ea tlhahiso ea elektronike, li ka aroloa ka mefuta e mengata ho latela sebopeho le ts'ebeliso ea tsona. Likarolo tsa bohlokoa li kenyelletsa:

1. Metal Core Printed Circuit Boards (MCPCBs): Lipoleiti tsena tsa motheo tsa koporo li na le motheo o entsoeng ka tšepe e phahameng ea mocheso oa mocheso, joalo ka aluminium kapa koporo, e nang le likarolo tsa koporo tsa foil bakeng sa ho etsa lipotoloho tse sebelisoang ho bonesa LED, li-converter tsa motlakase, le lisebelisoa tse ling tse hlokang hore mocheso o sebetse hantle.

2. Lisebelisoa tsa Ceramic Copper Base: Ho sebelisa lisebelisoa tsa ceramic e le lesela la insulating le koporo e le lesela la conductive, lipoleiti tsena tsa motheo li fana ka ho hanyetsa mocheso o phahameng ka ho fetisisa le ho kenya motlakase, tse loketseng lisebelisoa tsa microwave, semiconductor packaging, le lisebelisoa tse ling tse phahameng haholo.

3. Lipoleiti tsa Copper Base tse arohaneng ka Thermoelectrically: Ho kenyelletsa theknoloji e khethehileng ea karohano ea thermoelectric, ba boloka ts'ebetso e ntle ea mocheso ha ba ntse ba fana ka insulation ea motlakase, e loketseng tsamaiso ea mocheso ea lisebelisoa tsa elektroniki tse tsoetseng pele.

Mekhoa ea Tlhahiso

Mekhoa ea ho etsa lipoleiti tsa koporo hangata e na le mehato e latelang:

1. Tokisetso ea Substrate: Ho khetha koporo ea boleng bo holimo kapa lisebelisoa tse ling joalo ka tšepe kapa lirafshoa joalo ka substrate.

2. Ho Lokisoa ha Sebaka: Kalafo ea pele ea sebaka sa substrate ka ho hloekisa le ho khabisa ho lokisetsa ho khomarela ka mor'a moo foil ea koporo.

3. Ho tlamahanngoa ha Foil ea Koporo: Ho kopanya foil ea koporo ho substrate tlas'a mocheso o phahameng le khatello ea ho etsa lera la conductive.

4. Phetiso ea mohlala le ho Etching: Ho sebelisa photolithography, lasers, kapa mekhoa e meng ho fetisetsa mekhoa ea potoloho holim'a foil ea koporo le ho tlosa ka lik'hemik'hale libaka tse sa batleheng ho theha potoloho.

5. Pheliso ea Bokaholimo le Tšireletso: Ho sebelisa liphekolo tse holim'a metsi tse kang tin plating, OSP (Organic Solderability Preservatives), ENIG (Electroless Nickel Immersion Gold), joalo-joalo, ho matlafatsa thepa ea anti-oxidation le solderability.

Litšobotsi

Litšobotsi tsa bohlokoa tsa lipoleiti tsa koporo li kenyelletsa:

1. High Thermal Conductivity: The conductivity e phahameng ea mocheso oa koporo ka katleho e fokotsa mocheso oa ho sebetsa ka lisebelisoa tsa elektronike, ho lelefatsa bophelo ba tšebeletso.

2. Ts'ebetso e Ntle ea Motlakase: Koporo e phahameng e hloekileng e tiisa ho hanyetsa ho fokolang le likhokahano tse tsitsitseng tsa motlakase.

3. Matla a Mechini: Koporo le li-alloys tsa eona li bonts'a matla a phahameng, a loketseng litlhoko tse fapaneng tsa ts'ebetso le kopano.

4. Khanyetso ea Corrosion: Liphekolo tse khethehileng li fana ka khanyetso e ntle ea kutu ho lipoleiti tsa koporo, tse nolofalletsang ts'ebetso libakeng tse thata.

Libaka tsa Kopo

Lipoleiti tsa koporo li fumana ts'ebeliso e pharalletseng makaleng a mangata ka lebaka la thepa ea tsona e ikhethang:

1. Electronics le Mehala ea puisano: Lipotolohong tse nang le maqhubu a phahameng, lisebelisoa tsa microwave, li-tag tsa RFID, le lihlahisoa tse ling, lipoleiti tsa koporo tsa koporo li fana ka litsela tse ka tšeptjoang tsa phetisetso ea matšoao le tharollo ea ho senya mocheso.

2. Likoloi tsa Elektronike: Litsamaisong tsa taolo ea likoloi, mabone a LED, le lits'ebetso tse ling, ts'ebetso e phahameng ea ho tima mocheso oa lipoleiti tsa koporo e matlafatsa botsitso le polokeho ea sistimi.

3. Sepakapaka: Ka lisathelaete, lisebelisoa tsa radar le lisebelisoa tse ling tsa sefofane, ho tšepahala ho hoholo le bokhoni ba ho mamella maemo a feteletseng a lipoleiti tsa koporo li bohlokoa.

4. Matla le Lebone: Ka li-inverters tsa letsatsi, lisebelisoa tsa mabone a LED, le lisebelisoa tse tšoanang, bokhoni bo sebetsang ba ho senya mocheso oa lipoleiti tsa motheo tsa koporo li netefatsa botsitso ba nako e telele ea tsamaiso.