Qodobbada Muhiimka ah ee Xakamaynta Habraaca ee Habka Daabacaadda SMT ee Ku-xidhka Dhajinta

I. Xakamaynta Isticmaalka Dhalaalka Ku dheji

• Raac mabda'a koowaad - soo geli - marka hore - ka baxa. Ka dib marka koolada alxanka ay soo gaarto warshadda, isla markiiba ku dheji "Sumadda Xakamaynta Isticmaalka Koolada Alxanka" oo ku kaydi qaboojiyaha 2 - 8°C. Isticmaal koolada alxanka sida ku cad taariikhda uu dhacayo. Marka hore qaado koolada alxanka oo leh tiro yar. U ogolow koolada alxanka inay ku kululaato sanduuq qoyaan-celiya in ka badan 4 saacadood ka hor inta aan la isticmaalin. Buuxi foomka xakamaynta koolada alxanka marka aad qaadanayso koolada alxanka.

II. Xakamaynta Heerkulka Qaboojiyaha

• Heerkulka qaboojiyaha waa in lagu hayaa 2 - 8°C. Marka heerkulku aanu caadi ahayn, maareyso xaaladda oo buuxi "Foomka Diiwaanka Maareynta Heerkulka Aan Caadiga Ahayn ee Qaboojiyaha".

III. Xakamaynta Ku-darka Dhalaalka

1. Horay u deji tirada waqtiyada daabacaadda mashiinka iyadoo lagu saleynayo xaddiga koollada alxanka ee loo isticmaalo hal guddi oo gaar ahIC qaabka. Ku dar koolada alxanka sida loogu baahdo, xaqiiji xaddiga alxanka, oo buuxi "Foomka Diiwaanka Baarista iyo Ku Darista Alxanka".
2. Nadiifi daab-qashineedka balaastikada ah si aad ugu darto koolada alxanka.
3. Isticmaal koolada alxanka ee furan 24 saacadood gudahood. Koolada alxanka ee aan la furin waxaa lagu kaydin karaa jawi gudaha ah ugu badnaan

IV. Xakamaynta Stencil-ka

1. Nadiifinta Stencil-ka: Nadiifi Stencil-ka ka hor intaadan internetka gelin, 6-dii saacadoodba mar inta la isticmaalayo, iyo marka khadka wax soo saarku istaago 30 daqiiqo oo isku darka ah.
2. Kormeerka Nadiifinta Stencil-ka: Hubi stencil-ka ka dib nadiifinta si aad u hubiso inaysan jirin wax haraag ah oo ku jira darbiyada godka iyo wax dhaawac ah oo soo gaara stencil-ka.
3. Xakamaynta Xiisadda: Cabbir xiisadda mitirka xiisadda ka dib nadiifinta kasta marka aad internetka ku jirto iyo marka aad offline ku jirto. Xiisaddu waa inay noqotaa ≤ - 0.21mm ama ≥ 32N/cm.
4. Stencil SCRXakamaynta ap: Xidh stencil-ka marka uu gaaro wadarta guud ee 150,000 jeer oo la isticmaalo (oo lagu xisaabiyo PCS/isticmaalka) ama uu dhaawacmo.
5. Habka Nadiifinta Stencil-ka: Xakamee gelitaanka iyo bixitaanka stencil-ka adoo isticmaalaya nidaamka MES.

V. Hagaajinta Meelaynta PCB

VI. Xakamaynta Tuujiyaha

1. Maareynta Qubeyska: Adeegso nidaamka MES si aad u xakamayso dhammaan hawlgallada marka tuujiyuhu uu online noqdo oo aanu offline ahayn.
2. Nadiifinta iyo Hagaajinta: Nadiifi tuubada ka dib marka ay ka baxdo offline-ka. Hubi haddii ay wax dhaawac ah jiraan ka dib nadiifinta.
3. Xakamaynta Qashinka: Ku beddel tuujinta mid cusub ka dib marka la isticmaalo 150,000 oo jeer (ama marka ay waxyeello soo gaarto).

VII. Nadiifinta PCB

VIII. Xakamaynta Daabacaadda Dhajinta Alxanka

1. Mashiinka SPI wuxuu si toos ah u ogaanayaa (dhumucda, bedka, mugga, wareegga gaaban, daabacaadda maqan, iyo beddelka) wuxuuna diiwaangeliyaa loox kasta.
2. Haddii SPI aysan sameyn karinRFOgaanshaha sababtoo ah maqnaanshaha mashiinka SPI ama sababo kale oo aan caadi ahayn, samee kormeer aan kala sooc lahayn oo ay sameeyaan shaqaalaha. Si muuqaal ah u fiiri daabacaadda koollada alxanka (ma jiro wareeg gaaban, ma jiro daabacaad maqan, ma jiro wax ka beddel ama ka-beddel
3. Dhumucda koollada Alxanka & Xakamaynta Mugga:
   • Kala duwanaanshaha Tixraaca Xakamaynta Dhumucda Dhakada Alxanka: (Mashiinka SPI wuxuu inta badan ku shaqeeyaa mugga, dhumucdiisuna waa tixraac kaaliye ah.)
     • a. Wixii 0.5 mm Pitch CSP / Micro BGA: T - 0.005mm ~ T + 0.055mm
     • b. Wixii 0.5 mm QFP / QFN: T - 0.005mm ~ T + 0.055mm
     • c. Wixii 0.8 - 1.0 mm Heerka BGA/ CSP: T - 0.005mm ~ T + 0.065mm
     • d. Chip-ka Caadiga ah (RLC iyo kuwa kale): T - 0.005mm ~ T + 0.085mm (Taxliil: T = dhumucda stencil)
   • Xakamaynta Mugga Dhajinta Alxanka (cabirka mashiinka SPI):
     • a. Wixii 0.5 mm Pitch CSP / Micro BGA: 0.0016387 ~ 0.008194mm³
     • b. Loogu talagalay CSP/Micro BGA 0.65 - 0.8mm: 0.0065548 ~ 0.029497mm³
     • c. Loogu talagalay CSP/PBGA/Micro BGA 1.0mm: 0.0163871 ~ 0.081935mm³
     • d. Ka eeg lifaaqa soo socda si aad u ogaato xakamaynta mugga qaybaha kale.

• • Marka la isticmaalayo SPI si loo baaro tayada daabacaadda koollada alxanka, hawlwadeenku waa inuu fiiriyaa oo diiwaangeliyaa qiimaha CPK iyo dhumucda celceliska 2dii saacadoodba mar.