Pfungwa Dzakakosha dzeKudzora Maitiro muMaitiro ekudhinda eSMT Solder Paste

2025-03-15

I. Kudzora Kushandiswa kweSolder Paste

Solder Paste Printing.png

Tevedzera nhungamiro yekutanga - mukati - kutanga - kubuda. Mushure mekunge solder paste yasvika kufekitori, kurumidza kunamira "Solder Paste Usage Control Label" woichengeta mufiriji pa2 - 8°C. Shandisa solder paste zvichienderana nezuva rekupera kwayo. Tora solder paste ine nhamba diki kutanga. Rega solder paste idziye mubhokisi rinodzivirira hunyoro kweanopfuura maawa mana usati washandisa. Zadza fomu rekutonga solder paste paunenge uchitora solder paste.

II. Kudzora Kupisa muFiriji

Tembiricha yefiriji inofanira kuchengetwa pa2 - 8°C. Kana tembiricha isiri yakanaka, bata mamiriro acho ezvinhu wozadza "Record Form of Record of Refrigerator Temperature Abnormality Handling Record".

III. Kudzora Kuwedzera Paste yeSolder

Gadzirisa huwandu hwenguva dzekudhinda muchina zvichienderana nehuwandu hwepaste yekusolder inoshandiswa pane imwe panel yechinhu chakatsanangurwa.IC modhi. Wedzera paste yekusonesa sezvinodiwa, simbisa huwandu hwepaste yekusonesa, uye zadza "Fomu reKuongorora & Kuwedzera reSolder Paste".
Chengeta chipande chepurasitiki chekusanganisa mvura yekuisa paste.
Shandisa paste yakavhurwa yesolder mukati memaawa makumi maviri nemana. Paste yakavhurwa yesolder inogona kuchengetwa mukati meimba kwenguva inosvika pasi pemwedzi mumwe chete. Irase kana ikapfuura nguva yekuichengeta.

IV. Kudzora Stencil

Kuchenesa Stencil: Chenesa stencil usati watanga kushandisa online, maawa matanhatu ega ega panguva yekushandisa, uye kana mutsetse wekugadzira wamira kwemaminitsi makumi matatu.
Kuongorora Kuchenesa Stencil: Tarisa stencil mushure mekuchenesa kuti uve nechokwadi chekuti hapana zvakasara zve solder pamadziro emaburi uye hapana kukuvara kwestencil.
Kudzora Kushushikana: Yera kushushikana uchishandisa chiyereso chekumanikidza mushure mekuchenesa kwega kwega paunenge uchishanda online uye usiri online. Kushushikana kunofanira kuva ≤ - 0.21mm kana ≥ 32N/cm.
Stencil SCRKudzora: Bvisa stencil kana yasvika pakushandiswa ka150,000 (zvichiverengerwa nePCS/kushandiswa) kana kuti yakakuvara.
Maitiro Ekuchenesa Stencil: Dzora kupinda nekubuda kwestencil uchishandisa MES system.

V. Kugadziriswa kwePCB Positioning

Paunenge uchichinja mutsetse wekugadzira, tarisa gwara rekuyerera, saizi, nezvimwewo muforodha redata rekugadzira. Bata uye tsigira PCB nemazvo.

VI. Kudzora Kudzvanya

Kutarisira Squeegee: Shandisa sisitimu yeMES kudzora mashandiro ese kana squeegee ichipinda online uye isingasviki online.
Kuchenesa uye Kugadzirisa: Chenesa squeegee mushure mekunge yadzima. Tarisa kana paine kukuvara kwakaitika mushure mekuchenesa.
Kudzora Zvimedu: Tsiva chinotsvedza ne chitsva mushure mekushandisa ka150,000 (kana kana chakakuvara).

VII. Kuchenesa PCB

Chenesa PCB inoda kucheneswa nekuda kwekudhinda/kugovera zvisina kujairika, kuputsika kwemuchina, kana zvimwe zvikonzero zvisingatarisirwi. Uyewo, chenesa PCB yakadhindwa ne solder paste uye yagara isina kushanda kwemaawa anopfuura mana isina kupfuura nemaitiro e reflow soldering. (Cherechedza: Usachenese zvakananga mabhodhi eOSP nealcohol.)

VIII. Kudzora Kudhinda kweSolder Paste

Paunenge uchichinja mutsetse wekugadzira, tarisa marongero ari muforodha redata rekugadzira uye simbisa hunhu hwekudhinda hunotevera:

Muchina weSPI unoona otomatiki (ukobvu, nzvimbo, vhoriyamu, short-circuit, kudhinda kusiripo, offset) uye unonyora bhodhi rega rega.
Kana SPI isingakwanise kushandaRFKana paine kuonekwa kwechinhu ichi nekuda kwekushaikwa kwemuchina weSPI kana zvimwe zvikonzero zvisina kujairika, tarisa nevashandi. Tarisa nemaziso kudhinda kwe solder paste (hapana short- circuit, hapana kudhinda kuripo, hapana offset kana offset
Kukora kweSolder Paste & Kudzora Vhoriyamu:
- Solder Paste Ukobvu Control Reference Range: (Muchina weSPI unonyanya kutonga nehukuru, uye ukobvu ndewekubatsira.)
  - a. Ye 0.5 mm Pitch CSP / Micro BGA: T - 0.005mm ~ T + 0.055mm
  - b. Ye 0.5 mm Pitch QFP / QFN: T - 0.005mm ~ T + 0.055mm
  - c. Ye 0.8 - 1.0 mm Pitch BGA/ CSP: T - 0.005mm ~ T + 0.065mm
  - d. YeChip Yakajairika (RLC nedzimwe): T - 0.005mm ~ T + 0.085mm (Chirevo: T = ukobvu hwestencil)
- Kudzora Vhoriyamu yeSolder Paste (yekuyerwa kwemuchina weSPI):
  - a. Ye 0.5 mm Pitch CSP / Micro BGA: 0.0016387 ~ 0.008194mm³
  - b. YeCSP/Micro BGA 0.65 - 0.8mm: 0.0065548 ~ 0.029497mm³
  - c. YeCSP/PBGA/Micro BGA 1.0mm: 0.0163871 ~ 0.081935mm³
  - d. Tarisa pane zvinotevera zvakabatanidzwa kuti uzive kudzora huwandu hwezvimwe zvikamu.

Solder Paste.png

- Paunenge uchishandisa SPI kuongorora mhando yekudhinda kwe solder paste, mushandi anofanira kuona nekunyora kukosha kweCPK uye ukobvu hwepakati pemaawa maviri ega ega.