Kudikanwa kwePlasma Kuchenesa Pamberi peMultilayer Board Lamination
1. Background & Core Issues Mu multilayer PCB kugadzira, lamination bonds mukati cores, prepreg, uye copper foil pasi kupisa/kumanikidzwa. Zvinosvibisa (mafuta, maokisi, huruva) panzvimbo isati yacheneswa chikonzero: Kusasimba kwekubatana kwechiso: Kunotungamira kune delami...
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