Isi ihe dị mkpa nke njikwa usoro na usoro mbipụta akwụkwọ SMT Solder Tapawa

I. Njikwa Ojiji nke Solder Paste

• Soro ụkpụrụ nke mbụ - na - na - na - na - na - na - na - na - na - out. Mgbe ihe mkpuchi ahụ rutere n'ụlọ ọrụ mmepụta ihe, tinye ozugbo "Njikwa Njikwa Ihe Nlereanya ...

II. Njikwa Okpomọkụ nke friji

• A ga-edebe okpomọkụ friji ahụ na 2 - 8°C. Ọ bụrụ na okpomọkụ adịghị mma, dozie ọnọdụ ahụ ma dejupụta "Fọm Ndekọ Njikwa Okpomọkụ Refrigerator Abnormality".

III. Njikwa Mgbakwunye Mkpọchi Ihe Mgbanye

1. Debe ọnụọgụgụ oge ibipụta igwe dabere na ọnụọgụ nke ihe mmado solder ejiri maka otu panel nke otu nkọwapụtaIC ụdị. Tinye ihe mkpuchi dịka ọ dị mkpa, kwado ọnụọgụ ihe mkpuchi ahụ, wee dejupụta "Fọm Ndekọ Ihe Mgbochi na Mgbakwunye Ihe Mgbochi ...
2. Debe mma ngwakọta plastik ahụ ka ọ dị ọcha maka itinye ihe e ji agbaze ihe.
3. Jiri ihe mkpuchi e meghere emepe n'ime awa iri abụọ na anọ. Enwere ike ịchekwa ihe mkpuchi e mechiri emechi n'ime ụlọ ruo ihe karịrị otu ọnwa. Tụfuo ya ma ọ bụrụ na ọ gafere oge nchekwa.

IV. Njikwa Stensil

1. Nhicha Stencil: Hichaa stencil ahụ tupu ị banye n'ịntanetị, kwa awa isii mgbe ejiri ya, yana mgbe ahịrị mmepụta ahụ kwụsịrị ruo nkeji iri atọ.
2. Nnyocha Nhicha Stencil: Lelee stencil ahụ mgbe ị sachara ya iji hụ na ihe fọdụrụ na mpempe ihe e ji agbaze ihe na mgbidi oghere ahụ adịghịkwa emebi stencil ahụ.
3. Njikwa nrụgide: Jiri mita nrụgide tụọ nrụgide ahụ mgbe ị sachara ya mgbe ị na-aga n'ịntanetị na mgbe ị na-anọghị n'ịntanetị. Mmetụta ahụ kwesịrị ịdị ≤ - 0.21mm ma ọ bụ ≥ 32N/cm.
4. Stensịl SCRNjikwa ap: Kpụchaa stencil ahụ mgbe o ruru ugboro 150,000 nke ojiji (gbakọọ ya site na PCS/ojiji) ma ọ bụ mebie ya.
5. Usoro Nhicha Stencil: Jikwaa ntinye na ọpụpụ nke stencil site na iji sistemụ MES.

V. Mgbanwe Nhazi PCB

VI. Njikwa Squeegee

1. Njikwa Squeegee: Jiri sistemụ MES chịkwaa ọrụ niile mgbe squeegee ahụ na-aga n'ịntanetị na n'ịntanetị.
2. Nhicha na Nhazi: Hichaa ihe mkpuchi ahụ mgbe ọ gbanyụrụ na ntanetị. Lelee ma ọ bụrụ na ọ mebiri emebi mgbe ị sachara ya.
3. Njikwa Mkpọcha: Jiri nke ọhụrụ dochie squeegee ahụ mgbe ejiri ya ugboro 150,000 (maọbụ mgbe ọ mebiri emebi).

VII. Nhicha PCB

VIII. Njikwa Mbipụta Mkpọchi Solder

1. Igwe SPI na-achọpụta na akpaghị aka (ọkpụrụkpụ, mpaghara, olu, sekit dị mkpụmkpụ, mbipụta na-efu efu, kwụsịtụ) ma dekọọ bọọdụ ọ bụla.
2. Ọ bụrụ na SPI enweghị ike ịzụtaRFNchọpụta ahụ n'ihi enweghị igwe SPI ma ọ bụ ihe ndị ọzọ na-adịghị mma, mee nyocha na-enweghị usoro site n'aka ndị ọrụ. Lelee mbipụta solder mado anya (enweghị sekit dị mkpụmkpụ, enweghị mbipụta efu, enweghị mwepụ ma ọ bụ mwepụ
3. Njikwa Mkpọchi na Mkpọchi Olu:
   • Njikwa Mkpọchi Ọkpụrụkpụ nke Solder Paste: (Igwe SPI na-achịkwakarị site na olu, ọkpụrụkpụ ya bụkwa maka ntụaka enyemaka.)
     • a. Maka 0.5 mm Pitch CSP / Micro BGA: T - 0.005mm ~ T + 0.055mm
     • b. Maka 0.5 mm Pitch QFP / QFN: T - 0.005mm ~ T + 0.055mm
     • c. Maka 0.8 - 1.0 mm Pitch BGA/ CSP: T - 0.005mm ~ T + 0.065mm
     • d. Maka Nkịtị Chip (RLC na ndị ọzọ): T - 0.005mm ~ T + 0.085mm (Ihe ị ga-ekwu: T = ọkpụrụkpụ stencil)
   • Njikwa Mpịakọta Mpịakọta Solder (maka nha igwe SPI):
     • a. Maka 0.5 mm Pitch CSP / Micro BGA: 0.0016387 ~ 0.008194mm³
     • b. Maka CSP/Micro BGA 0.65 - 0.8mm: 0.0065548 ~ 0.029497mm³
     • c. Maka CSP/PBGA/Micro BGA 1.0mm: 0.0163871 ~ 0.081935mm³
     • d. Lee ihe mgbakwunye na-esonụ maka njikwa olu nke ihe ndị ọzọ.

• • Mgbe ị na-eji SPI iji lelee ịdị mma nke mbipụta ihe mkpuchi solder, onye ọrụ kwesịrị ịhụ ma dekọọ uru CPK na ọkpụrụkpụ nkezi kwa awa abụọ.