

Tooj liab PCB
Copper PCB, lossis Copper-Based Printed Circuit Board, yog hom kev luam tawm ntau tshaj plaws siv hauv hluav taws xob. Lo lus "Copper PCB" feem ntau yog hais txog PCB uas siv tooj liab ua cov khoom siv tseem ceeb rau nws cov khoom siv hluav taws xob. Tooj liab yog dav siv vim nws cov khoom siv hluav taws xob zoo heev, ductility, thiab tus nqi qis.
Nyob rau hauv Copper PCB, nyias txheej ntawm tooj liab yog laminated rau ib los yog ob sab ntawm ib tug uas tsis yog-conductive substrate, feem ntau yog ua los ntawm cov ntaub ntawv xws li FR-4 (ib tug iav fiber reinforced epoxy laminate), CEM-1 (ib daim ntawv thiab epoxy resin khoom), los yog polytetrafluoroethylene (PTFE, feem ntau hu ua Teflon). Cov khaubncaws sab nraud povtseg yog cov qauv siv photolithography thiab cov txheej txheem etching los tsim cov kev xav tau hauv Circuit Court, txuas ntau yam khoom siv hluav taws xob xws li resistors, capacitors, thiab kev sib xyaw ua ke.
Tsis muaj. | Yam khoom | Txheej Txheem Peev Xwm Parameter |
---|---|---|
1 | Khoom siv hauv paus | Copper Core |
2 | Number of Layers | 1 txheej, 2 txheej, 4 txheej |
3 | PCB Loj | Yam tsawg kawg nkaus: 5 * 5mm Qhov Loj: 480 * 286mm |
4 | Qib Qib | Txheem IPC 2, IPC 3 |
5 | Thermal conductivity (W / m * K) | 380 W |
6 | Board Thickness | 1.0mm ~ 2.0 hli |
7 | Min Tracing/Spacing | 4 mil / 4 mil |
8 | Plated Los ntawm qhov loj me | ≥0.2 hli |
9 | Tsis-Plated Through-qhov loj | ≥0.8mm |
10 | Tooj Thickness | 1oz, 2oz, 3oz, 4oz, 5oz |
11 | Solder Mask | Ntsuab, Liab, Daj, Dawb, Dub, Xiav, Ntshav, Matte Ntsuab, Matte Dub, Tsis muaj |
12 | Nto tiav | Immersion Kub, OSP, Hard Kub, ENEPIG, Immersion Silver, Tsis muaj |
13 | Lwm Txoj Kev Xaiv | Countersinks, Castellated Qhov, Kev Cai Stackup thiab lwm yam. |
14 | Daim ntawv pov thawj | ISO9001, UL, RoHS, REACH |
15 | Kev sim | AOI, SPI, X-ray, Flying Probe |