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Ho'oholo 'ana i ka wrinkling Copper Foil in Roll-to-Roll (R2R) Flexible Circuit Production.

2025-04-17

Wrinkling Copper Foil.jpeg

1. Nā kumu kumu o ka wrinkling

ʻO nā kumu koʻikoʻi ke kumu i ka wrinkling copper foil i nā kaʻina R2R:

  • ʻAʻohe kaulike: Ke koʻikoʻi koʻikoʻi kūloko ma muli o nā gradients hoʻopaʻapaʻa.

  • Kūlike ʻole CTE: Copper (17 ppm/°C) vs. PI (35 ppm/°C) hoonui like ole.

  • Nā hemahema kaʻa: Misalignment (>0.01 mm/m) a i ʻole ka hoʻohaumia ʻana i ka ʻili.

  • Nā hemahema lamination: ʻAʻole kūlike ka mahana / kaomi a i ʻole ke kahe resin.

2. Nā Kūlana Manaʻo

(1) Hoʻonui i ka ʻōnaehana Tension

  • Ka hoʻomalu hoʻopaʻa ʻana:
    Mālama nā mīkini servo + hoʻouka i ka ʻāʻī i loko o ± 0.1 N/mm.

  • ʻO ka haʻalulu liʻiliʻi:
    Hoʻopau ʻia ka ʻāʻī ʻana i ka wā e wili hou ana (�=�0×(�0/�)�, n=0.8–1.2).

  • ʻO nā huila anti-wrinkle:
    ʻO nā huila hoʻolaha lei aliʻi (R=1500 mm no ka laula pūnaewele 500 mm).

(2) Hoʻokele Thermal-Mechanical

  • Ka hoomalu ana i ka wela:
    5–8 mau ʻāpana me ≤3°C gradient (preheat=80°C, nui=180°C, cool=50°C).

  • Kaulike paʻi:
    ʻO nā pads silikoni (Shore A 30–50) a i ʻole nā ​​ʻōnaehana cushion ea no>95% kūlike.

(3) ʻEnekinia Mea

  • keleawe haʻahaʻa haʻahaʻa:
    ʻO ka pepa i hoʻohuli ʻia (Rz=1–2 μm) e hōʻemi i ka hakakā.

  • Lapaʻau mua ʻana:
    ʻO ka hana plasma Ar/O₂ (500 W, 30 s) hoʻokiʻekiʻe i ka ikehu ili i 50 mN/m.

  • Hoʻopono hoʻopili:
    ʻO nā acrylic kahe nui (viscosity

(4) Mālama i nā lako

  • ʻO ka hoʻolālikelike ʻana i ka wili:
    ʻO ka alignment laser wiki (± 0.001 mm) a me ka nānā ʻana i ka ʻili (Ra

  • Mālama ʻōnaehana hoʻokele:
    ʻO ka lubrication alakaʻi laina a me ka hoʻoponopono backlash gear (

3. Nānā Manawa maoli

  • ʻO ka nānā ʻana:
    ʻIke nā pahu kiʻi laina-scan (5000 fps) + CNN algorithms i nā wrinkle 0.1 mm².

  • Hōʻike kiʻi laser:
    Ke ana i ka palahalaha (

  • Kiʻi wela wela:
    Nānā i ka mahana (± 2°C ka paepae alarm).

4. Kaʻina Hana

Kaʻina Hana Pākuʻi Kiʻi Lahi Pahuhi
Ka hoʻoluliluli ʻana ʻO ka pololei haʻalulu ±0.05 N/mm
Lamination mahana. Ka wela wahi nui 180±2°C
Pumi lamination Pumi unite 2.5±0.1 MPa
ʻĀpana lipi Pākuʻi hoʻohaʻahaʻa haʻahaʻa (n) 0.9–1.0
Hoʻopololei kaʻa ʻAxial deviation

5. Nānā Hiʻohiʻona

  • hihia 1: 50μm PI + 12μm Cu foil

    • Pane: ʻO nā ʻōwili palahalaha + ʻāwili liʻiliʻi (n=0.95)

    • Ka hopena: Ua emi mai ka wrinkling mai 5% a i 0.3%, 20% ki'eki'e ka hua.

  • hihia 2: LCP substrate kiʻekiʻe

    • Hoʻoulu plasma + lamination cushion ea

    • Ka hopena: Dk hoʻololi