Kikowaena ʻike

1. ʻO ka PTFE Surface Challenges ʻO ka ikaika o ka honua haʻahaʻa o PTFE (18–24 mN/m) a me ka inertness kemika e alakaʻi ai i: Adhesion nāwaliwali: Ka nele o nā pūʻulu hana no ka hoʻopili kemika; ʻAʻole hiki ke hoʻomaʻemaʻe: Ke kihi pili> 110 °; Kūlike ʻole CTE: PTFE (100&n...

1. Nā Waiwai a me nā Pōmaikaʻi o Supercritical CO₂ Supercritical CO₂ (scCO₂) hui pū ʻia ka diffusivity e like me ke kinoea (≈10⁻⁷ m²/s) a me ka mana hoʻonā wai-like (solubility parameter≈0.5–2.5 (cal/cm³) crit/s) ma luna o kona.

1. Nā Kumu a me nā Pono o ka Cold Spray Cold Spray kahi kaʻina hana hoʻopaʻa paʻa kahi e hoʻolalelale ʻia ai nā pauka metala (eg, Cu) e ke kinoea piʻi kiʻekiʻe (N₂ / He) i nā wikiwiki supersonic (300-1200 m / s), e hana ana i nā uhi paʻa ma o ka plastic deformation ...

1. Nā kumu a me nā hopena o MicrobubblesMicrobubbles (1–50 μm voids) i hana ʻia e ke kinoea i hoʻopaʻa ʻia i ka wā o ka lamination hoʻohaʻahaʻa: Hana uila: Hoʻonui i ka poho dielectric (e laʻa, +0.005 tanδ ma 10 GHz); Ka ikaika mīkini: 30–50% ʻulaʻula...

ʻO ka hopena o ka iwi ʻīlio e pili ana i ke ʻano i ʻoi aku ka nui o ka mānoanoa o ka plating ma ke komo ʻana a me ka puka i waho ma mua o ka ʻāpana waena i ka wā o ka hoʻoheheʻe ʻia ʻana ma waena o ka lua. Ke kū nei kēia mai ka liʻiliʻi ʻana o ka electrolyte mass transfer a me ka ...

Kirkendall voids, ma muli o ka ʻokoʻa atomic diffusion rates, hoʻohaʻahaʻa koʻikoʻi i ka hilinaʻi hui pū. ʻO nā hoʻolālā koʻikoʻi e hoʻopau i kā lākou hoʻokumu ʻana ma SAC305 (Sn-3.0Ag-0.5Cu): 1. Alloy Composition Optimization Trace alloying elements: ...

1. Nā Kumu a me nā Pōmaikaʻi o Aerosol Jet Printing Aerosol Jet Printing (AJP) waiho i nā inika hana e like me ka micron-scale aerosols (1-5 μm) me ka hoʻohana ʻana i ke kinoea sheath e kālele ana, e hiki ai: ʻO ka hoʻonā kiʻekiʻe: 10 μm linewidth me ± 2 μm hoʻokomo ac...

1. Hiki i nā TSV Fundamentals a me 2.5D/3D ArchitecturesThrough-Silicon Via (TSV) ke hoʻohui i nā kuʻekuʻe ma o nā substrate silika, koʻikoʻi no ka hoʻopaʻa ʻana i nā puʻupuʻu (3D) a i ʻole ka hoʻohui ʻana i ka interposer-based (2.5D). Loaʻa nā pōmaikaʻi nui: Nā pilina pōkole: TSVs...

1. Wehewehe a me na Pahuhopu o Asymmetric Stack-upsAsymmetric layer stack-ups e hoʻopaʻa pono i ka pono o ka hōʻailona, ​​ka hoʻokele wela, a me ka ikaika mechanical ma o ka mānoanoa mea like ʻole, nā ʻano keleawe (e laʻa, RCF, LP), a me nā dielectric mau (Dk). Loaʻa nā pahuhopu nui...

I. He aha ka Paena Aia i loko o ka pūnaewele nā ​​mea ʻelua: "现" (manawa o kēia manawa) a me "场" (wahi). ʻO "现" e hoʻoikaika i ke kino, e pili ana i kēia manawa. ʻO ka "场" e hōʻike ana i ka ʻāina, e pili ana i kahi wahi kino. Hoʻohui ʻia: ʻO ka pūnaewele kahi ...