Mahimman Abubuwan Kula da Tsarin Aiki a Tsarin Manna na SMT na Manna

I. Sarrafa Amfani da Manna Mai Solder

• Bi ƙa'idar farko - shiga - fita ta farko. Bayan man shafawa mai laushi ya isa masana'anta, nan da nan a manna "Lakabin Kula da Amfani da Man shafawa Mai Solder" sannan a adana shi a cikin firiji a zafin 2 - 8°C. Yi amfani da man shafawa mai solder bisa ga ranar ƙarewa a jere. Ɗauki man shafawa mai ƙaramin lamba da farko. Bari man shafawa mai solder ya dumama a cikin akwati mai hana danshi na fiye da awanni 4 kafin amfani. Cika fom ɗin sarrafa man shafawa mai solder lokacin shan man shafawa.

II. Kula da Zafin Firji

• Ya kamata a kiyaye zafin firiji a 2 - 8°C. Idan zafin bai yi daidai ba, a kula da yanayin sannan a cike "Fom ɗin Rikodin Rikodin Rikodin Rikodin Zafin Firji".

III. Kula da Ƙarin Manna na Solder

1. Saita adadin lokutan buga injin bisa ga adadin manna mai solder da aka yi amfani da shi don kwamiti ɗaya na takamaiman bayaniIC samfurin. Ƙara man shafawa kamar yadda ake buƙata, tabbatar da adadin man shafawa, sannan a cike "Fom ɗin Duba Man shafawa da Ƙarawa".
2. A ajiye ruwan haɗin filastik ɗin da ke cikinsa don ƙara man shafawa mai laushi.
3. Yi amfani da man shafawa da aka buɗe cikin awanni 24. Ana iya adana man shafawa da ba a buɗe ba a cikin yanayi na cikin gida na tsawon sama da wata 1. A jefar da shi idan ya wuce lokacin ajiya.

IV. Kula da Siminti

1. Tsaftace Stencil: Tsaftace stencil ɗin kafin shiga intanet, duk bayan sa'o'i 6 yayin amfani, da kuma lokacin da layin samarwa ya tsaya na tsawon mintuna 30.
2. Duba Tsaftace Stencil: Duba stencil ɗin bayan tsaftacewa don tabbatar da cewa babu ragowar man shafawa a bangon ramuka kuma babu lalacewa ga stencil ɗin.
3. Kula da Tashin Hankali: A auna tashin hankalin da na'urar auna tazara bayan kowace tsaftacewa lokacin da ake yin amfani da intanet da kuma a layi. Ya kamata tashin hankalin ya kasance ≤ - 0.21mm ko ≥ 32N/cm.
4. Stencil SCRSarrafa ap: A goge stencil ɗin idan ya kai jimillar sau 150,000 na amfani (wanda aka ƙididdige ta hanyar PCS/amfani) ko kuma ya lalace.
5. Tsarin Tsaftace Stencil: Sarrafa shigarwa da fita na stencil ta amfani da tsarin MES.

Daidaita Matsayin PCB V.

VI. Kula da Matsewar Ruwa

1. Gudanar da Matsi: Yi amfani da tsarin MES don sarrafa duk ayyukan lokacin da matsi ya shiga yanar gizo ko kuma a layi.
2. Tsaftacewa da Daidaitawa: Tsaftace mashin ɗin bayan ya fita daga intanet. Duba ko akwai wata matsala bayan tsaftacewa.
3. Kula da Ɓatattun Kaya: Sauya matsewar da sabuwa bayan an yi amfani da ita sau 150,000 (ko kuma lokacin da ta lalace).

VII. Tsaftace PCB

VIII. Kula da Buga Manna na Solder

1. Injin SPI yana gano ta atomatik (kauri, yanki, girma, da'ira ta gajere, bugu da ya ɓace, da'ira ta rama) kuma yana yin rikodin kowane allo.
2. Idan SPI ba zai iya yin aiki baRFBinciken da aka yi saboda rashin na'urar SPI ko wasu dalilai marasa kyau, gudanar da bincike bazuwar daga ma'aikata. Duba bugun manna na solder da ido (babu gajeriyar da'ira, babu bugu da ya ɓace, babu offset ko offset
3. Manna mai kauri & Ikon ƙara:
   • Nau'in Manne Mai Kauri Mai Solder: (Injin SPI galibi yana sarrafawa ta hanyar girma, kuma kauri yana don ƙarin bayani.)
     • a. Don 0.5 mm Pitch CSP / Micro BGA: T - 0.005mm ~ T + 0.055mm
     • b. Don girman QFP / QFN na 0.5 mm: T - 0.005mm ~ T + 0.055mm
     • c. Don 0.8 - 1.0 mm Fitilar BGA/ CSP: T - 0.005mm ~ T + 0.065mm
     • d. Ga Chip ɗin Al'ada (RLC da sauransu): T - 0.005mm ~ T + 0.085mm (Sharhi: T = kauri na stencil)
   • Sarrafa Ƙarar Manna na Solder (don auna injin SPI):
     • a. Don 0.5 mm Pitch CSP / Micro BGA: 0.0016387 ~ 0.008194mm³
     • b. Don CSP/Micro BGA 0.65 - 0.8mm: 0.0065548 ~ 0.029497mm³
     • c. Don CSP/PBGA/Micro BGA 1.0mm: 0.0163871 ~ 0.081935mm³
     • d. Duba ƙarin bayani game da yadda ake sarrafa ƙarar wasu sassan.

• • Lokacin amfani da SPI don duba ingancin bugu na manna mai solder, mai aiki ya kamata ya lura kuma ya rubuta ƙimar CPK da matsakaicin kauri a kowane awa 2.